Manufacturing method of ultra-long flexible circuit board

Abstract

The invention relates to a method for manufacturing a super-long flexible circuit board, which comprises the following steps of: during appearance forming, cutting twice, namely, firstly cutting a plurality of primary appearance cutting positions, adhering a high-temperature adhesive tape strip to the primary appearance cutting positions, and cutting off the rest positions during secondary cutting, so as to form the super-long flexible circuit board. After the chip mounting process is completed, the obtained super-long flexible circuit board is directly torn off from the high-temperature adhesive tape, and the problem that a connecting point is torn does not exist in the mode; in addition, by folding the super-long flexible substrate and clamping the carrier plate between the super-long flexible substrate and the carrier plate, the effect of halving a single solder paste brushing plate surface and a patch plate surface is achieved, so that the purpose of assembling components can be achieved by adopting the existing conventional equipment, and the expansion and contraction range of the super-long flexible substrate is halved due to folding the super-long flexible substrate, so that the production efficiency is improved. And the assembly yield is improved.

Description

technical field [0001] The invention relates to the technical field of flexible printed circuit boards, in particular to a manufacturing method of an ultra-long flexible circuit board. Background technique [0002] The flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material, abbreviated as soft board or FPC. Light weight, thin thickness, flexible and other notable features, its application is very wide. Due to the thin and flexible characteristics of FPC, it plays a significant role in medical applications of in-vivo diagnosis and detection. Ultra-long and ultra-fine FPC has quickly become the preferred technical solution for medical device manufacturers. [0003] However, the existing ultra-long FPC components face the following three main problems during assembly: [0004] 1. In traditional SMT imposition, most of the shapes are cut before SMT is used, and only a few connection poin...

AI Technical Summary

Problems solved by technology

For FPCs with a length of more than 800mm, the current FPCA manufacturers cannot assemble them. They can only be realized by purchasing large-scale equipment with huge sums of money. For most manufacturers who mainly focus on small and medium-sized FPCs, this is a low rate of return. investment

[0006] 3. Due to the thinness of the material and the easy wrinkling of the FPC, the easy moisture absorption of the dielectric layer and other problems, the size expansion and contraction and the stability of the expansion and contraction have always been the main problems that it needs to face when assembling components, and the expansion and contraction problem faced by the ultra-long FPC Larger, high solder paste printing offset defect rate

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