Halogen-free resin composition with low expansion coefficient, laminated board and printed circuit board

Abstract

The invention discloses a low-expansion-coefficient halogen-free resin composition, a laminated board and a printed circuit board. The halogen-free resin composition provided by the invention comprises the following components in parts by weight: (a) 30 to 40 parts of o-cresol formaldehyde epoxy resin, (b) 50 to 70 parts of bismaleimide resin, (c) 75 to 105 parts of cyanate hardener, (d) 30 to 45 parts of bisphenol A type DOPO hardener, (e) 10 to 20 parts of non-DOPO phosphorus-containing flame retardant and (f) 2 to 12 parts of DOPO flame retardant. According to the halogen-free resin composition provided by the invention, through specific components and proportions, the epoxy resin composition with low expansion coefficient, low dielectric loss and high rigidity can be provided, and better toughness and heat resistance are provided.

Description

technical field [0001] The present application relates to a resin composition and a laminate and a printed circuit board using the epoxy resin composition, in particular to a halogen-free resin composition with low expansion coefficient, low dielectric loss, high rigidity, laminate and A printed circuit board. Background technique [0002] Under the continuous fever of the communication electronics market, high-frequency and high-speed transmission has become a necessary option, and the circuit board that plays the role of carrying components, power supply and signal transmission has become the key to the development of this field. The existing technology epoxy resin and phenolic The printed circuit board made of resin material can no longer meet the advanced application of high frequency. [0003] In the printed circuit board technology, it is mainly a thermosetting resin composition including epoxy resin and hardener, which is heated and combined with a reinforcing materi...

AI Technical Summary

Problems solved by technology

Generally, thermosetting resin compositions use phenol novolac resin hardeners with hydroxyl groups (-OH). When combined with epoxy resins, the epoxy groups will open to form hydroxyl groups, and the hydroxyl groups will increase the dielectric constant and dielectric properties. loss value, and is easy to compare with H 2 O bonding, causing increased hygroscopicity

[0004] The prior art epoxy resin compositions use halogen-containing flame retardants (especially brominated flame retardants), such as tetrabromocyclohexane, hexabromocyclodecane and 2,4,6-tri(tribromocyclodecane) Phenoxy)-1,3,5-triazine, etc., flame retardants containing halogen components have the advantages of good flame retardancy and less addition. However, halogen products are used in product manufacturing, use, and even in recycling or It is easy to cause pollution to the environment when discarded. In addition, halogen-containing electronic equipment waste will produce corrosive and toxic gases and smoke when burned, and dioxins, dibenzofurans, etc. will be detected in the products after combustion. carcinogen

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