Preparation process and application of aluminum-chromium alloy target material

A preparation process, aluminum-chromium alloy technology, applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of inconvenient packaging and unpacking, insufficient density of target materials, etc., and achieve good practical value and Promote the value, ensure the effect of heat insulation, and improve the effect of surface corrosion resistance

Pending Publication Date: 2022-07-22
漳州市合琦靶材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a preparation process of an aluminum-chromium alloy target and its application in view of the above-mentioned problems currently existing, and to effectively solve the problems caused by the target in the prior art by rationally improving the design of the target preparation process. Insufficient density, inconvenient packaging and other technical problems, so as to avoid the shortcomings and defects of the existing technology

Method used

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  • Preparation process and application of aluminum-chromium alloy target material
  • Preparation process and application of aluminum-chromium alloy target material
  • Preparation process and application of aluminum-chromium alloy target material

Examples

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Embodiment 1

[0036] Example 1, as Figure 1-4 shown:

[0037] A preparation process of an aluminum-chromium alloy target, comprising the following specific steps:

[0038] Step S1: alloy powder preparation;

[0039] Step S2: packing the prepared alloy powder into the casing 5, assembling and fixing the left and right halves of the casing 5 by means of bolts and nuts, and performing cold isostatic pressing;

[0040] Step S3: performing the first degassing treatment on the alloy target blank formed in step S2;

[0041] Step S4: The alloy target blank formed in Step S3 is subjected to the first hot isostatic pressing treatment, and the second degassing treatment is carried out, and then the package 5 is taken out;

[0042] Step S5: the blank after the second degassing treatment is loaded into the package 5, and the second hot isostatic pressing treatment is performed;

[0043] Step S6: take out the envelope 5 from the blank subjected to the second HIP treatment, carry out machining and cl...

specific Embodiment 2

[0059] Specific embodiment 2, such as Figure 1-4 shown:

[0060] A preparation process of an aluminum-chromium alloy target, comprising the following specific steps:

[0061] Step S1: alloy powder preparation;

[0062] Step S2: packing the prepared alloy powder into the casing 5, assembling and fixing the left and right halves of the casing 5 by means of bolts and nuts, and performing cold isostatic pressing;

[0063] Step S3: performing the first degassing treatment on the alloy target blank formed in step S2;

[0064] Step S4: The alloy target blank formed in Step S3 is subjected to the first hot isostatic pressing treatment, and the second degassing treatment is carried out, and then the package 5 is taken out;

[0065] Step S5: the blank after the second degassing treatment is loaded into the package 5, and the second hot isostatic pressing treatment is performed;

[0066] Step S6: take out the envelope 5 from the blank subjected to the second HIP treatment, carry out...

specific Embodiment 3

[0074] Specific embodiment 3, as Figure 1-4 shown:

[0075] A preparation process of an aluminum-chromium alloy target, comprising the following specific steps:

[0076] Step S1: alloy powder preparation;

[0077] Step S2: packing the prepared alloy powder into the casing 5, assembling and fixing the left and right halves of the casing 5 by means of bolts and nuts, and performing cold isostatic pressing;

[0078] Step S3: performing the first degassing treatment on the alloy target blank formed in step S2;

[0079] Step S4: The alloy target blank formed in Step S3 is subjected to the first hot isostatic pressing treatment, and the second degassing treatment is carried out, and then the package 5 is taken out;

[0080] Step S5: the blank after the second degassing treatment is loaded into the package 5, and the second hot isostatic pressing treatment is performed;

[0081] Step S6: take out the envelope 5 from the blank subjected to the second HIP treatment, carry out mach...

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Abstract

The invention belongs to the technical field of target material preparation, and particularly relates to a preparation process and application of an aluminum-chromium alloy target material, and the preparation process of the target material comprises the following steps: S1, preparing alloy powder; s2, the prepared alloy powder is loaded into a sheath, the left half block and the right half block of the sheath are spliced and fixed in a bolt and nut fixing mode, and cold isostatic pressing treatment is carried out; s3, carrying out primary degassing treatment on the alloy target blank; s4, carrying out first hot isostatic pressing treatment on the alloy target blank formed in the step S3, carrying out second degassing treatment, and then taking out the sheath; s5, the blank obtained after second-time degassing treatment is loaded into a sheath, and second-time hot isostatic pressing treatment is carried out; s6, the blank subjected to second-time hot isostatic pressing treatment is taken out of the sheath, machining and cleaning treatment are carried out, and vacuum heat treatment is carried out; and S7, the surface of the alloy target material obtained in the step S6 is modified with an anti-corrosion layer and a heat insulation layer. The composite material is high in compactness, uniform in crystal grain and relatively good in mechanical property.

Description

technical field [0001] The invention belongs to the technical field of target material preparation, and particularly relates to a preparation process and application of an aluminum-chromium alloy target material. Background technique [0002] With the rapid development of the semiconductor industry, as an important material for the manufacture of semiconductor electronic devices, the demand for coating materials is also increasing. Target is an important coating material. The main method for preparing thin-film materials through targets is physical vapor deposition (PVD). The most commonly used method is sputtering coating, which is widely used in integrated circuits, flat panel displays, solar energy, optical devices, etc. field has a wide range of applications. [0003] The traditional target processing technology is mainly casting technology, especially the casting of metal targets, mainly by machining and heat treatment of ingots, etc. This technology has the advantages...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/15C23C14/34C22C21/00B22F3/04B22F3/24C22C1/04
CPCB22F3/15C23C14/3407C22C21/00B22F3/04B22F3/24C22C1/0416B22F2003/248B22F2003/242B22F2003/153
Inventor 吴丽君
Owner 漳州市合琦靶材科技有限公司
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