Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive

A technology of conductive adhesive and conductive powder, which is applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems of not many products required for use, low thermal conductivity, and the inability to use conductive adhesives, etc., to achieve high conductivity, high Good thermal conductivity, thermal conductivity and electrical conductivity

Inactive Publication Date: 2011-09-07
YANTAI DARBOND TECH
View PDF3 Cites 49 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductivity of traditional ordinary conductive adhesive is relatively low, lower than 10W / m·K, while the heat dissipation of high-brightness and high-power LED chips requires its thermal conductivity to be higher than 20W / m·K, so traditional conductive adhesive cannot be used , so it is necessary to develop materials with higher thermal conductivity, such as high thermal conductivity conductive adhesives, and at the same time must be equal to or even better than traditional conductive adhesives in terms of adhesive performance, electrical performance, application performance, and reliability.
There have been some conductive adhesive products in China, but there are not many products that can fully meet the requirements for the use of high-brightness and high-power LED chips.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive
  • Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive
  • Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 1 in Table 1, bisphenol A epoxy resin and 1,4-butanediol glycidyl ether were mixed for 10 minutes until uniform, and then Add dicyandiamide, 2-heptadecyl imidazole and 3-aminopropyltriethoxysilane, mix at room temperature for 10 minutes to form a homogeneous mixture, and then grind it through a three-roll machine until it becomes a fine and uniform mixture, then add the particle size range The conductive adhesive can be prepared by mixing 0.5 micron to 100 micron micron flake silver powder at a low speed for 30 minutes at room temperature.

Embodiment 2

[0025] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 2 in Table 1, mix bisphenol F epoxy resin and neopentyl glycol glycidyl ether for 10 minutes until uniform, and then add diamino Diphenylmethane and 3-aminopropyltriethoxysilane were mixed at room temperature for 10 minutes to form a homogeneous mixture, and then ground by a three-roll machine until it became a fine and uniform mixture, and then added micron-sized particles with a particle size range of 0.5 microns to 100 microns The flake silver powder and the nano-scale silver wire with a wire diameter ranging from 50 nanometers to 1 micron and a length ranging from 1 micron to 100 microns can be mixed in a low-speed vacuum at room temperature for 30 minutes to prepare a conductive adhesive.

Embodiment 3

[0027] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 3 in Table 1, mix bisphenol A epoxy resin and polyethylene glycol diglycidyl ether for 10 minutes until uniform, and then add diamino Mix diphenyl ether and 3-aminopropyltrihydroxysilane for 10 minutes at room temperature to form a homogeneous mixture, and then grind it on a three-roll machine until it becomes a fine and uniform mixture, then add micron-sized flakes with a particle size range of 0.5 microns to 100 microns The conductive adhesive can be prepared by mixing silver powder and nano-scale silver wires with wire diameters ranging from 50 nanometers to 1 micron and lengths ranging from 1 micron to 100 microns in a low-speed vacuum at room temperature for 30 minutes.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Lengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a conductive adhesive for LED (light emitting diode) packaging. The conductive adhesive consists of the following raw materials in percentage by weight: 75 to 95 percent of conductive powder, 2 to 12 percent of epoxy resin, 1 to 10 percent of epoxy diluting agent, 1 to 3 percent of curing agent, 0 to 1 percent of curing accelerator, and 0.5 to 2 percent of coupling agent. The LED conductive adhesive provided by the invention has superior performance and good heat conduction and electric conduction effects and can fully meet operating requirements of a high-brightness high-power LED chip.

Description

technical field [0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a conductive adhesive for packaging high-brightness and high-power LEDs (light-emitting diodes) and a preparation method thereof. Background technique [0002] In recent years, the application of LED (light-emitting diode) has developed rapidly in the field of lighting. Compared with traditional light sources, LED lighting has obvious advantages in energy saving and environmental protection. It is the future trend of indoor lighting, landscape lighting, vehicle lighting and other fields. . LED chip packaging technology is one of the core technologies of LED device manufacturing. Traditional packaging technology can well meet the requirements of traditional low-power and low-brightness LED devices. However, for the packaging of emerging high-brightness and high-power LED chips, as the power of LED chips increases, and when LED chips perform electro-optical...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/00C09J163/02C09J163/10C09J9/02H01L33/56
Inventor 吴光勇王建斌陈田安
Owner YANTAI DARBOND TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com