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Stripping solution for stripping metal cadmium-plated layer and stripping method thereof

A stripping solution and metal plating technology, applied in the field of chemical stripping, can solve the problems of skin irritation, high pollution, limited use range, etc. Effect

Pending Publication Date: 2022-07-19
四川兴荣科科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Patent CN111020587A discloses a stripping solution and stripping process for removing nickel layer on copper surface, and its preparation raw materials include: sodium bromide, oxidizing agent, tartaric acid, urea, benzotriazole, cobalt acetate and water, oxidizing agent etc. It has excellent properties such as high stripping efficiency of nickel layer and no corrosion to copper substrate. However, the cobalt acetate contained in its preparation raw material is irritating to the skin and has certain physiological toxicity.
[0005] Patent CN111690933A discloses a stripping solution and a stripping method for an unqualified cadmium-plated layer. The raw materials for its preparation include sulfur, 2,4-dinitrobenzenesulfonic acid hydrate, and hexamethylenetetramine. The stripping solution The composition does not contain highly toxic hexavalent chromium, which avoids the high pollution problem of using chromic acid stripping solution, but it is only suitable for the stripping of steel substrates, and the scope of use is limited

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  • Stripping solution for stripping metal cadmium-plated layer and stripping method thereof
  • Stripping solution for stripping metal cadmium-plated layer and stripping method thereof

Examples

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Embodiment 1

[0021] Embodiment 1 provides a raw material for the preparation of a stripping solution for removing a metal cadmium plating layer, which, in terms of weight percentages, includes: 3% of siloxane compounds, 4% of amine compounds, 8% of salt compounds, and supplemented by water. balance to 100%.

[0022] The siloxane compound is a compound of siloxane ketone and polydimethylsiloxane, the mass ratio of siloxane ketone and polydimethylsiloxane is 1.4:0.6, and the CAS number of the siloxane ketone is 1.4:0.6. It is 63148-62-9, purchased from Hangzhou Baisi Chemical Technology Co., Ltd., and the polydimethylsiloxane CAS number is 9016-00-6, purchased from Sigma-Aldrich (Shanghai) Trading Co., Ltd.;

[0023] The amine compound is a compound of ammonia water, polyacrylamide, and bis-(4-methoxybenzyl)-amine, and the quality of ammonia water, polyacrylamide, and bis-(4-methoxybenzyl)-amine The ratio is 1.0:0.2:1.4, the ammonia water CAS number is 1336-21-6, purchased from Shanghai Ala...

Embodiment 2

[0029] Embodiment 2 provides a raw material for the preparation of a stripping solution for removing a metal cadmium plating layer, which, in weight percentages, includes: 4% of siloxane compounds, 5% of amine compounds, 10% of salt compounds, and supplemented by water. balance to 100%.

[0030] The siloxane compound is a compound of siloxane ketone and polydimethylsiloxane, the mass ratio of siloxane ketone and polydimethylsiloxane is 1.4:0.6, and the CAS number of the siloxane ketone is 1.4:0.6. It is 63148-62-9, purchased from Hangzhou Baisi Chemical Technology Co., Ltd., and the polydimethylsiloxane CAS number is 9016-00-6, purchased from Sigma-Aldrich (Shanghai) Trading Co., Ltd.;

[0031] The amine compound is a compound of ammonia water, polyacrylamide, and bis-(4-methoxybenzyl)-amine, and the quality of ammonia water, polyacrylamide, and bis-(4-methoxybenzyl)-amine The ratio is 1.0:0.2:1.4, the ammonia water CAS number is 1336-21-6, purchased from Shanghai Aladdin Bio...

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Abstract

The invention relates to the technical field of chemical deplating, in particular to a deplating solution for deplating a metal cadmium plating layer and a deplating method of the deplating solution, and the IPC classification number of the deplating solution is C23G. The stripping solution for stripping the metal cadmium plating layer comprises the following preparation raw materials in percentage by weight: 2-4% of siloxane compounds, 3-5% of amine compounds, 7-10% of salt compounds and the balance of water. A siloxane compound, an amine compound and a salt compound are added into water to be stirred and mixed to prepare the stripping solution for stripping the metal cadmium plating layer, a metal plating piece with the cadmium plating layer is immersed into the stripping solution, the plating piece is turned over to be immersed into the stripping solution until the plating layer is completely stripped, the metal plating piece with the cadmium plating layer is cleaned with water, and the metal cadmium plating layer is removed. The stripping solution for stripping the metal cadmium plating layer can well remove the metal cadmium plating layer of aluminum, iron and copper base materials, is suitable for various base materials, has a good cadmium stripping effect, does not corrode the surface of the metal base material, and does not damage the metal base material.

Description

technical field [0001] The invention relates to the technical field of chemical stripping, the IPC classification number is C23G, and in particular relates to a stripping solution for stripping a metal cadmium plating layer and a stripping method thereof. Background technique [0002] The stripping solution is a special metal coating on the surface of the workpiece that is removed by immersion, ultrasonic waves, electrolysis, etc. It is a chemical liquid that will not dissolve or corrode the workpiece itself. When the industrially produced parts are unqualified or equal to the reuse of the workpiece, the workpiece needs to be stripped and reprocessed. If the coating on the workpiece is not thoroughly treated, the plating solution will be polluted. [0003] The removal methods of metal coatings are mainly divided into two categories: chemical methods and electrochemical methods. Generally, the selection is based on the chemical properties of the coating and the substrate. The...

Claims

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Application Information

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IPC IPC(8): C23F1/44C23F1/40C23F11/08
CPCC23F1/44C23F1/40C23F11/08Y02P10/20
Inventor 周晓荣白建军
Owner 四川兴荣科科技有限公司
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