Method for improving pure copper grain boundary corrosion resistance by increasing coherent twin grain boundary proportion

Abstract

The invention belongs to the field of batteries, and discloses a method for improving pure copper grain boundary corrosion resistance by increasing coherent twin grain boundary proportion, which comprises the following steps: performing repeated room-temperature multidirectional forging on pure copper, and then recrystallizing and annealing for 10 minutes at 600 DEG C to homogenize the structure of the pure copper; and the pure copper with the homogenized structure is subjected to small-deformation cold rolling, the rolling deformation is 5%, and then vacuum annealing is conducted at the temperature of 650 DEG C for 5-15 min. Pure copper is subjected to small-deformation high-temperature short-time annealing to obtain a primary recrystallization structure, although the grain boundary characteristic distribution of the primary recrystallization structure has a certain proportion of sigma 3 special grain boundaries, the proportion of coherent twin boundaries is not high, and a considerable number of non-coherent twin boundaries exist; according to the method, the annealing time is prolonged on the basis of primary recrystallization, the crystal grains are further made to grow, the result shows that the proportion of coherent twin boundaries is monotonically increased along with the growth of the crystal grains and finally exceeds 50%, and the crystal boundary corrosion resistance of pure copper is greatly improved.

Description

technical field [0001] The invention relates to the field of materials, in particular to a method for improving the corrosion resistance of pure copper grain boundaries by increasing the proportion of coherent twin grain boundaries. Background technique [0002] Cu is a low stacking fault energy metal with a face-centered cubic structure. Due to its excellent corrosion resistance, thermal conductivity and electrical conductivity, it is often used as a raw material for corrosion-resistant components, heat exchangers, wires, and electronic components. Although copper has excellent corrosion resistance, under some specific conditions, such as in wet halogen, sulfide and oxidizing acid environments, grain boundary corrosion is prone to occur. At present, the methods to improve the corrosion resistance of copper grain boundaries are as follows: 1. Covering protection method, coating a layer of anti-rust paint, oil, plastic, etc. on the copper surface, so that the copper surface ...

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Problems solved by technology

In addition, in the past, the proportion of Σ3 special grain boundaries was determined based on misorientation, and the proportion of coherent twin grain boundaries could not be accurately determined.

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