Phenolic resin composition and its preparation method and application in the preparation of stamping die
A phenolic resin and stamping die technology, applied in the field of polymer composite materials, can solve the problems of low production efficiency, high temperature, long curing time, etc., and achieve the effect of low use cost and light weight
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[0040] Example: A phenolic resin composition, the composition includes, according to mass g, 10~40g of phenolic resin, 10~40g of styrene-butadiene rubber, 5~12g of iron powder, 6~8g of carbon-based material, and 7g of non-ferrous metal powder. ~13g, metal oxide 0.2~3g, basalt fiber 10~13g and dispersant 2.4~5.3g. The carbon-based material is selected from carbon nanotubes and / or carbon fibers; the non-ferrous metal powder is selected from at least one of Zr, Ni or Cu; the metal oxide is Al 2 O 3 , TiO 2 , Ni 2 O 3 , Fe 3 O 2 or at least one of CoO. The modified phenolic resin is a polyimide-modified phenolic resin, and the mass ratio of the phenolic resin to the polyimide in the polyimide-modified phenolic resin is 1:0.125~2. The iron powder is selected from reduced iron powder and / or electrolytic iron powder, and the mesh number of the iron powder is selected from 800-1600 mesh. The iron powder includes 2-4 parts of 1600-mesh electrolytic iron powder, 1-3 parts of 160...
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