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Copper foil improvement method

A technology of copper foil and template, applied in the field of copper foil improvement, can solve the problems such as the pressing quality of copper foil needs to be improved, and achieve the effects of improving the forming quality, the surface cleanliness, and the degree of lamination.

Pending Publication Date: 2022-06-17
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a method for improving copper foil, which solves the problem that the pressing quality of copper foil needs to be improved

Method used

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  • Copper foil improvement method
  • Copper foil improvement method

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Embodiment 1

[0059] Please refer to figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 ,in, figure 1 It is a three-dimensional diagram of the first embodiment of the pressing device to be used in the copper foil improvement method provided by the present invention; figure 2 for figure 1 The schematic diagram of the overall structure shown; image 3 for figure 2 The schematic diagram of the structure of the spring expansion part shown; Figure 4 It is a schematic structural diagram of the pressing device that needs to be used in the copper foil improvement method provided by the present invention in a closed state; Figure 5 It is a schematic structural diagram of the pressing device to be used in the copper foil improvement method provided by the present invention in a pressing state.

[0060]A method for improving copper foil, the pressing device used in the step S3 includes: a mounting seat 1; a fixing frame 2, the fixing frame 2 is fixedly installed on the mounting sea...

Embodiment 2

[0081] see Image 6 ,Also includes:

[0082] A preheating mechanism 9, the preheating mechanism 9 includes a fan 91, a drainage pipe 92 and a heater 93, the fan 91 is fixedly installed on the pressing box 3, and a drainage is installed at the input end of the pressing box 3 Pipe 92, the input end of the drainage pipe 92 pipes through the pressing box 3 and the fixing frame 2 in turn, and the output end of the pressing box 3 is installed with a heater 93, and the heater 93 is fixedly installed in the On the press box 3.

[0083] It is convenient to preheat the lower template 5 inside the pressing box 3 through the fan 91 and the heater 93 inside the pressing box 3, so as to provide a stable constant temperature environment for the pressing environment. When the equipment is required to dissipate heat, only the When the heater 93 is turned off, the fan 91 can provide a more stable cooling air source for the lower formwork 5, and provide support for rapid cooling after the equi...

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Abstract

The invention provides a copper foil improvement method. The copper foil improvement method comprises the following steps: S1, selecting a copper foil raw material; s2, cutting the copper foil raw material in a dust-free environment; s3, the cut copper foil is installed on a pressing device, and cutting and pressing are conducted through a concentric-square-shaped mold; s4, in the pressing process, the constant-temperature state is maintained; and S5, cooling the laminated copper foil in a natural environment, and molding the cooled copper foil. According to the copper foil improvement method provided by the invention, the copper foil raw material is cut in a dust-free environment before being pressed, so that the surface of the cut copper foil is complete and free of air attachments, the surface of the copper foil is clean and tidy in the pressing process, and constant-temperature treatment in the pressing process can effectively improve the laminating degree of pressing and enhance the pressing quality of the copper foil; therefore, the forming quality of the laminated copper foil is improved.

Description

technical field [0001] The invention relates to the technical field of copper foil processing, in particular to a method for improving copper foil. Background technique [0002] Copper foil is a cathodic electrolytic material, a thin, continuous metal foil deposited on the base layer of the circuit board. After the circuit pattern is formed, the copper foil has the characteristics of low surface oxygen, which can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. It is mainly used in electromagnetic shielding and antistatic. It is placed on the substrate surface and combined with the metal substrate, which has excellent conductivity and provides the effect of electromagnetic shielding. [0003] The wrinkling of copper foil after lamination occurs on the surface of copper foil after lamination. The more common ones are stripes, veins, straight lines, and even flakes in severe cases. The depth is 0.05mm-0.5mm, and ...

Claims

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Application Information

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IPC IPC(8): B32B37/06B32B37/10B32B38/00
CPCB32B37/06B32B37/10B32B38/0004
Inventor 邢晓朝廖旭辉黄春燕石浪佘上华孟伟
Owner AOSHIKANG TECH CO LTD
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