Micro multi-channel boiling heat exchange type uniform-temperature cooling plate

Abstract

The invention relates to a micro multi-channel boiling heat exchange type uniform-temperature cooling plate which comprises a cooling liquid inlet channel on the left side, at least two cooling liquid boiling combined multi-channels evenly distributed in the middle in the vertical direction and a boiling gas outlet channel on the right side. And each cooling liquid boiling combined multi-channel is composed of a liquid cross-flow straight channel, a gas rising narrow channel and a gas cross-flow straight channel which are sequentially communicated from bottom to top, so that a liquid cooling working medium input from the cooling liquid inlet channel is boiled and gasified when exchanging heat with a cooled object, flows upwards and is discharged from the boiling gas outlet channel. According to the invention, high-heat-flux heat transfer of boiling heat transfer of the micro-channel can be realized, high uniformity of the temperature of the cooling plate can be ensured, and the cooling plate is suitable for heat dissipation and cooling of high-power power electronic components or new energy automobile power batteries.

Description

technical field [0001] The invention belongs to the technical field of high heat flux density cooling, and in particular relates to a tiny multi-channel boiling heat-exchange type uniform temperature cooling plate. Background technique [0002] In recent years, with the continuous development of micro-nano processing technology, the development of micro-electromechanical systems, large-scale integrated circuits and high-power lasers has also made great progress. Advanced technology industries such as aerospace, nuclear energy technology, energy power, and electric vehicles are paying more and more attention to the miniaturization and integration of electronic equipment. The trend of power improvement and miniaturization of electronic equipment has led to a continuous increase in the heat flux of its heat generation. For example, the average heat flux density of computer chips can reach 100W / cm 2 , in which the heat flux density of the local hot spot reaches 500W / cm 2 ; For...

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Problems solved by technology

[0006] At present, most micro-channel heat exchange coolers are parallel-flow micro-multi-channel coolers. The flow and heat transfer of liquid working fluid in each single channel are as follows: Image 6 As shown, the cooling medium enters from the left inlet, and in the liquid single-phase region, convective heat transfer is the main method. As the heat transfer progresses, the temperature of the liquid working medium increases gradually, and the temperature difference between the working medium and the contact heat source gradually decreases. , resulting in a gradual decrease in convective heat transfer, that is, a gradual increase in the temperature of the heat exchanger along the flow direction; followed by subcooled nucleate boiling, Baohe nucleate boiling, and liquid film convective boiling stages, all of which are boiling phases In the changed two-phase coexistence state, the heat transfer coefficient gradually increases slightly, and the temperature of the heat exchanger shows a gradual downward trend; at the rear of the single channel, the cooling working medium enters the state of saturated steam and superheated steam, that is, it shows a lack of liquid Heat transfer state, which is a significant decrease in the heat transfer coefficient, resulting in a significant increase in the temperature of the heat exchanger

Therefore, although the parallel flow micro multi-channel heat exchanger can obtain a large amount of heat transfer, the temperature difference between the upstream and downstream inlet and outlet of the cooler working fluid is relatively large, which means that the temperature difference of the cooled device often exceeds the allowable range , it is easy to cause excessive thermal stress on the cooled device and reduce the service life of the device

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