Low-loss black hole micro-etching liquid as well as preparation method and application thereof

Abstract

The invention relates to the technical field of printed circuit board processing, in particular to a low-loss black hole micro-etching solution and a preparation method and application thereof. The low-loss black hole micro-etching liquid is prepared from the following components in percentage by weight: 30 to 50 permillage of sulfuric acid, 8 to 1 permillage of H2O2, 0.8 to 1.2 permillage of a copper protecting component, 1.0 to 2.0 permillage of a dispersing agent, 0.8 to 1.5 permillage of a corrosion inhibitor, 0.3 to 1.0 permillage of a hydrogen peroxide stabilizer and the balance of water, and the copper protection component is one or more of dodecenylsuccinic acid, monoethanolamine borate and triethanolamine borate. According to the low-loss black hole micro-etching liquid with the proportion, the copper surface black hole conductive material is effectively stripped, meanwhile, the loss of the copper surface is reduced, the stripped black hole conductive material is not prone to being reversely adhered to the copper surface, and therefore the surface performance and the yield of a PCB are guaranteed.

Description

technical field [0001] The present application relates to the technical field of printed circuit board processing, and more particularly, to a low-loss black hole micro-etching solution and a preparation method and application thereof. Background technique [0002] Black hole technology refers to the technology of depositing a layer of black high-quality conductive nano-carbon on the hole wall, and using the excellent conductivity of this layer of medium for subsequent electroplating operations. It is also a key process in circuit board production. It is not only adsorbed on the fibers in the hole, but also adsorbed on the metal copper surface. If the black hole liquid on the surface is allowed to exist on the surface, it will affect the bonding force of electroplating. Therefore, the black hole micro-etching treatment technology came into being. [0003] The black hole micro-etching treatment technology in the related art mainly includes a sodium persulfate (SPS) system, a ...

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Problems solved by technology

[0004] Although the above-mentioned sulfuric acid-hydrogen peroxide system can also complete the micro-etching treatment of black holes, its application is often limited. The main reason is that it requires an etching amount of more than 2um to peel off the black hole conductive material, and the loss of copper surface after peeling is generally relatively small. Large, the stripped black hole conductive material is also very easy to re-adsorb on the copper surface, so it is difficult to meet the process requirements, and the commercial value is low

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