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Manufacturing method of ultra-thin copper thick printed circuit board

A technology for printed circuit board and production method, which is applied in the directions of laminated printed circuit board, printed circuit, printed circuit manufacturing, etc., can solve the problems of inconsistent with the production concept, high production cost, large resource consumption, etc.

Pending Publication Date: 2022-05-27
GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, both the MSAP process and the traditional three-line production process have problems such as large resource consumption and high production costs, which obviously do not conform to the current production concept of clean production and sustainable development.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for making an ultra-thin copper-thick printed circuit board, which is characterized by comprising the following steps: cutting material—inner layer circuit—pressing—drilling—electrochemical copper plating—outer layer dry film—acidic Etching - AOI - post process.

[0040] Further, in the lamination process, a release film is used to complete the lamination process to form a copper-free multilayer printed circuit board on the outer layer.

[0041] Further, after the lamination process is completed, an optical core board is formed.

[0042] Further, after the drilling process is completed, a chemical degumming process is used to remove the hole wall and residual drilling dirt.

[0043] Further, after the chemical degumming process is completed, ultrasonic waves are used to treat the grooves and spikes generated by the degumming process.

[0044] Further, the electrolytic copper plating process includes the following steps:

[0045] S1. Adopt catalytic reduction...

Embodiment 2

[0055] A method for making an ultra-thin copper-thick printed circuit board, which is characterized by comprising the following steps: cutting material—inner layer circuit—pressing—drilling—electrochemical copper plating—outer layer dry film—acidic Etching - AOI - post process.

[0056] Further, in the lamination process, a release film is used to complete the lamination process to form a copper-free multilayer printed circuit board on the outer layer.

[0057] Further, after the lamination process is completed, an optical core board is formed.

[0058] Further, after the drilling process is completed, a chemical degumming process is used to remove the hole wall and residual drilling dirt.

[0059] Further, after the chemical degumming process is completed, ultrasonic waves are used to treat the grooves and spikes generated by the degumming process.

[0060] Further, the electrolytic copper plating process includes the following steps:

[0061] S1. Adopt catalytic reduction s...

Embodiment 3

[0071] A method for making an ultra-thin copper-thick printed circuit board, which is characterized by comprising the following steps: cutting material—inner layer circuit—pressing—drilling—electrochemical copper plating—outer layer dry film—acidic Etching - AOI - post process.

[0072] Further, in the lamination process, a release film is used to complete the lamination process to form a copper-free multilayer printed circuit board on the outer layer.

[0073] Further, after the lamination process is completed, an optical core board is formed.

[0074] Further, after the drilling process is completed, a chemical degumming process is used to remove the hole wall and residual drilling dirt.

[0075] Further, after the chemical degumming process is completed, ultrasonic waves are used to treat the grooves and spikes generated by the degumming process.

[0076] Further, the electrolytic copper plating process includes the following steps:

[0077] S1. Adopt catalytic reduction...

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PUM

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Abstract

The invention belongs to the technical field of PCB (printed circuit board) processing, and provides a manufacturing method of an ultra-thin copper-thick printed circuit board, which comprises the following steps of cutting, inner-layer circuit processing, laminating, drilling, electrochemical copper plating, outer-layer film drying, acid etching, AOI (automatic optical inspection) and post-processing. According to the invention, the production cost can be effectively reduced, the process is shortened, the copper foil consumption in the pressing process is reduced, the consumption of copper balls in the electroplating process is reduced, and the consumption of etching materials in the etching process is reduced; in addition, the method provided by the invention can reduce the generation of waste etching liquid and is beneficial to environmental protection.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, in particular to a method for manufacturing an ultra-thin copper-thick printed circuit board. Background technique [0002] The rapid development of electronic communication equipment and automotive products has made the printed circuit board as a component carrier constantly updated. In order to meet the current and signal transmission, the fine lines on the printed circuit board need to have a more regular shape, and the lines can be with greater thickness. [0003] As we all know, the production methods of fine lines on printed circuit boards mainly include subtractive method, semi-additive method and full additive method. The fine lines prepared by the subtractive method have serious side erosion and extremely irregular lines. It is impossible, and the defects of the semi-additive method and the full-additive method are mainly that the bonding force between the circuit and the substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/00
CPCH05K3/022H05K3/0058
Inventor 刘继承翟翔王玲玲
Owner GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
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