Preparation method of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film

Abstract

The invention discloses a preparation method of an epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film, and relates to the field of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive films. Epoxy resin and an electric-conducting accelerant are uniformly mixed and fully ground, silver powder is added, then a diluent, a coupling agent and an anti-aging agent are added and uniformly mixed, a curing agent is added and uniformly mixed, and the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. The epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film solves the problems that the design requirement cannot be met when an electric-conducting silver adhesive material is used for packaging, and cracking deformation is caused by thermo-oxidative aging of an epoxy resin-based material; through the synergistic effect of the epoxy resin, the electric conduction accelerant, the silver powder and the anti-aging agent, the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film has good manufacturability during application, packaging of thinner and smaller chips is achieved, meanwhile, piperazine and piperidine are integrated in the same molecule through a chemical synthesis method, and therefore the heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. And the anti-aging agent has a more efficient anti-aging effect.

Description

technical field [0001] The invention relates to the field of epoxy resin-based heat-conducting heat-resistant conductive adhesive film, in particular to a preparation method of epoxy resin-based heat-conducting heat-resistant conductive adhesive film. Background technique [0002] With the development of social science and technology, human beings are pursuing more and more high-tech products, and constantly require products to achieve more functions in smaller and smaller dimensions, prompting semiconductor packaging to find thinner, smaller and more Reliability solutions for high packing densities, addressed in part by providing the materials used in the manufacture of ultra-small semiconductor devices; [0003] In the traditional chip packaging connection, materials such as lead-tin solder or conductive silver glue are usually used. Since the minimum pitch of lead-tin soldering is only 0.65mm when using lead-tin solder for packaging, it is easy to The phenomenon of glue ...

AI Technical Summary

Problems solved by technology

[0006] (1) Mix the epoxy resin and the conductive accelerator evenly, grind them fully, add silver powder, mix evenly, vacuumize, then add diluent, coupling agent and anti-aging agent, mix evenly, add curing agent, mix evenly, vacuumize , to obtain the epoxy resin-based heat-conducting and heat-resistant conductive adhesive film, which solves the problem of chip side climbing and chip tilting when the conductive silver adhesive material is used for packaging, which cannot meet the design requirements and the cracking caused by the thermal oxygen aging of the epoxy resin-based material deformation problem;

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