Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip failure analysis method and device, electronic equipment and medium

A failure analysis and chip technology, which is applied in the field of semiconductor analysis, can solve the problems of reducing grinding efficiency and safety, difficulty in controlling grinding samples, and insufficient grinding stability, so as to improve grinding stability and safety, and improve failure analysis efficiency Effect

Pending Publication Date: 2022-05-06
GIGA FORCE ELECTRONICS CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the grinding table rotates at a high speed, it is difficult for fingers to control the grinding sample to keep it still, resulting in insufficient grinding stability, which will also reduce grinding efficiency and safety

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip failure analysis method and device, electronic equipment and medium
  • Chip failure analysis method and device, electronic equipment and medium
  • Chip failure analysis method and device, electronic equipment and medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0075] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of them. Based on the embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0076] The preferred embodiments of the application will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the application, and are not used to limit the application, and in the absence of conflict, the application The embodiments and the features in the embodiments can be combined with each other.

[0077] figure 2 It is a sc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
softening pointaaaaaaaaaa
Login to View More

Abstract

The invention provides a chip failure analysis method and device, electronic equipment and a medium. The method comprises the steps that after hot melt wax in a first state is obtained, the first state is a softened state, a sample to be ground is embedded into one side of the hot melt wax in the first state in a preset embedding mode, the other side of the hot melt wax in the first state is molded, and a grinding body in the first state is obtained; the to-be-ground sample in the grinding body is kept horizontal; based on the grinding body in the first state, a grinding body in a second state is obtained, and the second state is a solidification state; after the hot melt wax molded on the grinding body in the second state is fixed, grinding the to-be-ground sample in the grinding body to obtain a to-be-analyzed chip; and performing failure analysis on the to-be-analyzed chip to obtain an analysis result. According to the method, the grinding stability and safety are improved, and the failure analysis efficiency is also improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor analysis, in particular, to a chip failure analysis method, device, electronic equipment and media. Background technique [0002] Grinding is one of the current high-precision processing methods. At present, consolidated grinding discs are generally used to grind various brittle and hard materials, such as semiconductor silicon wafers and sapphire. However, in the prior art, the grinding sample is usually pressed on the grinding table with fingers, such as figure 1 shown. If the grinding table rotates at a high speed, it is difficult for fingers to control the ground sample to keep it still, resulting in insufficient grinding stability, and also reducing grinding efficiency and safety. Contents of the invention [0003] The purpose of the embodiments of the present application is to provide a chip failure analysis method, device, electronic equipment and medium to solve the abo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28B24B37/27
CPCG01R31/2898B24B37/27
Inventor 宋涛高强郑朝晖
Owner GIGA FORCE ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com