Through hole electrical performance optimization design method and device, PCB and equipment

A technology of electrical performance and optimized design, applied in the direction of electrical components, electrical connection printed components, printed circuits, etc., can solve the problems of low electrical performance of through holes, increase the difficulty of processing, increase the difficulty of design, and improve the electrical performance of through holes. Effect

Pending Publication Date: 2022-03-25
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems existing in the prior art, the present invention innovatively proposes a through-hole electrical performance optimization design method, device, PCB board and equipment, effectively solving the problem of low electrical performance of the through-hole due to the prior art, effectively Improved PCB through-hole electrical performance

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  • Through hole electrical performance optimization design method and device, PCB and equipment
  • Through hole electrical performance optimization design method and device, PCB and equipment
  • Through hole electrical performance optimization design method and device, PCB and equipment

Examples

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Effect test

Embodiment 1

[0035] The invention provides a method for optimizing the electrical performance of a through hole, including:

[0036] When the diameter of the pad and the diameter of the anti-pad remain unchanged, the copper plating ratio of the through hole is increased to improve the electrical performance of the through hole in the PCB board; where, the copper plating ratio=1-hole diameter / drilling diameter .

[0037] Among them, increasing the copper plating ratio of the through hole is specifically:

[0038] Keep the diameter of the drilled hole constant, and increase the copper plating ratio of the through hole by adjusting the size of the hole diameter; or, keep the hole diameter constant, and increase the copper plating ratio of the through hole by adjusting the size of the drilled hole diameter. After the increase, the copper plating ratio of the through hole is in the range of 0.3-0.4. Preferably, after the increase, the copper plating ratio of the through hole is 0.4.

[0039]...

Embodiment 2

[0062] The technical solution of the present invention also provides a through-hole electrical performance optimization design device, including:

[0063] Adjust the module to increase the copper plating ratio of the through hole under the condition that the diameter of the pad and the diameter of the anti pad are unchanged, so as to improve the electrical performance of the through hole in the PCB board; where, the copper plating ratio=1-hole diameter / Drill hole diameter.

[0064] Among them, increasing the copper plating ratio of the through hole is specifically:

[0065] Keep the diameter of the drilled hole constant, and increase the copper plating ratio of the through hole by adjusting the size of the hole diameter; or, keep the hole diameter constant, and increase the copper plating ratio of the through hole by adjusting the size of the drilled hole diameter. After the increase, the copper plating ratio of the through hole is in the range of 0.3-0.4. Preferably, after...

Embodiment 3

[0072] The technical solution of the present invention also provides a PCB board, which is formed on the basis of adopting the method for optimizing the electrical performance of through-holes in Embodiment 1.

[0073] The copper plating ratio of the through hole in the PCB board is in the range of 0.3-0.4. Preferably, the copper plating ratio of the through holes is 0.4.

[0074] For example, in high-speed PCB board design, through holes of 8mil (hole diameter)-10mil (drilling aperture)-18mil (pad diameter)-28mil (anti-pad diameter) are usually used as the carrier of signal interconnection. For this kind of through hole, its copper plating ratio (Plating Ratio) is generally 1-8 / 10=0.2; Carry out replating to through hole (between hole and drilling), obtain new copper plating ratio, namely Ensure that the drill hole diameter (Drill Hole Diameter) remains unchanged at 10mil, and change the copper plating ratio to 0.3-0.4, that is, the corresponding finish hole diameter (Finish...

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PUM

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Abstract

The invention provides a through hole electrical performance optimization design method, which comprises the following steps of: under the condition that the diameter of a bonding pad and the diameter of an anti-bonding pad are not changed, increasing the copper plating ratio of a through hole so as to improve the electrical performance of the through hole in a PCB (Printed Circuit Board); wherein the copper plating ratio is equal to 1 minus the aperture of the formed hole / the aperture of the drilled hole, the invention further provides a through hole electrical performance optimization design device, a PCB and equipment, the three electrical performance indexes of IL, RL and TDR of a via hole (through hole) are all greatly improved, the design difficulty of a single board is not increased, the processing difficulty of the single board is not increased, and the electrical performance of the through hole in the PCB is effectively improved.

Description

technical field [0001] The invention relates to the field of PCB system design, in particular to a through-hole electrical performance optimization design method, device, PCB board and equipment. Background technique [0002] In the design of high-speed and high-density single boards, the design of high-speed signals is the most important. Among them, the processing of high-speed vias is the most important. Signal integrity engineers are constantly striving to design high-speed vias with better electrical performance. Such as figure 1 Shown, the composition of high-speed vias. High-speed vias include drilling, forming holes, pads, and anti-pads. Copper plating between the drilled and formed holes gives the vias electrical properties. [0003] In the through-hole design of high-speed single board, the existing through-hole design usually uses 8mil (hole diameter)-10mil (drilling aperture)-18mil (pad diameter)-28mil (anti-pad diameter) as signal interconnection Carrier. ...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K1/11
CPCH05K3/42H05K1/115
Inventor 李浩然
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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