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Low-precipitation matte polyester chip for laminating flexible circuit board and preparation method of low-precipitation matte polyester chip

A technology for flexible circuit boards and polyester chips, applied in the field of polyester chips, can solve the problems of reduced mechanical and chemical properties of polymers, pollution of polyester film film surface, and increase in the number of terminal carboxyl groups, etc., to achieve high insulation, improve Intrinsic viscosity of raw materials and the effect of increasing molecular weight

Pending Publication Date: 2022-03-18
TIANJIN WANHUA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the preparation process of polyester chip raw materials, since the esterification reaction in the PET synthesis process is a reversible reaction, the polymerization reaction is limited by the conditions and can only partially react to produce polymers with the target molecular weight PET, and the rest are oligomers with different molecular weights. , the production process of these oligomer films will have a great impact, which limits the application of films in insulating materials under high temperature conditions. Higher temperature, partial thermal degradation and hydrolysis of matte polyester chips lead to a decrease in molecular weight and an increase in the number of terminal carboxyl groups, resulting in serious membrane surface pollution in the polyester film and on the film surface, and the mechanical and chemical properties of the polymer are reduced

Method used

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  • Low-precipitation matte polyester chip for laminating flexible circuit board and preparation method of low-precipitation matte polyester chip
  • Low-precipitation matte polyester chip for laminating flexible circuit board and preparation method of low-precipitation matte polyester chip

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preparation example Construction

[0017] The preparation method of the low-separation matt polyester chips used for lamination of flexible circuit boards of the present invention comprises the following steps:

[0018] (1) Mix ethylene glycol and catalyst evenly and add to the reactor for pre-esterification reaction at a temperature of 175-188°C and a pre-esterification time of 3-5 hours;

[0019] (2) Add the feed liquid and terephthalic acid after the pre-esterification reaction to a stirrer and stir evenly into the reactor, feed nitrogen gas, turn on the circulating water, and carry out the esterification reaction. The esterification temperature is controlled at 265-280°C, The curing time is 5~7h;

[0020] (3) After the esterification reaction is finished, start vacuuming, and carry out the precondensation reaction at a pressure of 2500 to 3500Pa and a temperature of 275 to 285°C for 1.5 to 3 hours;

[0021] (4) At a temperature of 280-320°C and a vacuum pressure of 45-85Pa, the chain extender PMDA is added...

Embodiment 1

[0028] A kind of production method of low precipitation matte polyester chips, described low precipitation matt polyester chip preparation steps are as follows:

[0029] (1) Mix ethylene glycol and catalyst ethylene glycol antimony and add them evenly into the reactor for pre-esterification reaction at a temperature of 175-188°C and a pre-esterification time of 3-5 hours;

[0030] (2) Add the feed liquid and terephthalic acid after the pre-esterification reaction to a stirrer and stir evenly into the reactor, feed nitrogen gas, turn on the circulating water, and carry out the esterification reaction. The esterification temperature is controlled at 265-280°C, The curing time is 5~7h;

[0031] (3) After the esterification reaction is finished, start vacuuming, and carry out the precondensation reaction at a pressure of 2500 to 3500Pa and a temperature of 275 to 285°C for 1.5 to 3 hours;

[0032] (4) Add the chain extender pyromellitic dianhydride (PMDA) at a temperature of 280-...

Embodiment 2

[0036] A kind of production method of low precipitation matte polyester chips, described low precipitation matt polyester chip preparation steps are as follows:

[0037] (1) Mix ethylene glycol and catalyst ethylene glycol antimony and add them evenly into the reactor for pre-esterification reaction at a temperature of 175-188°C and a pre-esterification time of 3-5 hours;

[0038] (2) Add the feed liquid and terephthalic acid after the pre-esterification reaction to a stirrer and stir evenly into the reactor, feed nitrogen gas, turn on the circulating water, and carry out the esterification reaction. The esterification temperature is controlled at 265-280°C, The curing time is 5~7h;

[0039] (3) After the esterification reaction is finished, start vacuuming, and carry out the precondensation reaction at a pressure of 2500 to 3500Pa and a temperature of 275 to 285°C for 1.5 to 3 hours;

[0040] (4) Add the chain extender pyromellitic dianhydride (PMDA) at a temperature of 280-...

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Abstract

The invention discloses a low-precipitation matte polyester chip for laminating a flexible circuit board and a preparation method of the low-precipitation matte polyester chip, which comprises the following steps: (1) increasing the molecular weight of PET (polyethylene terephthalate) and increasing the intrinsic viscosity by expanding a molecular chain to prepare a low-precipitation PET matte polyester chip; (2) raw materials are extracted by adopting supercritical CO2 fluid, oligomers and residues in the preparation process are removed, and environmental pollution is avoided by adopting an environment-friendly extraction and purification mode. According to the low-precipitation matte polyester chip disclosed by the invention, a chain extension and tackifying manner is adopted, so that the phenomenon of precipitation of a common matte polyester film in a long-time high-temperature working environment of high-temperature lamination of a flexible circuit board is overcome. By adopting a CO2 fluid extraction mode, the purity of the raw materials is further improved, and oligomers and other impurities are reduced.

Description

technical field [0001] The invention relates to a polyester chip, in particular to a low-separation matte polyester chip used for lamination of flexible circuit boards and a preparation method thereof. Background technique [0002] Polyester film (BOPET) has excellent comprehensive properties and is widely used in composite materials, packaging materials, photosensitive materials, decorative materials and other fields. Although the overall performance of polyester film products is very good, some defects in itself also limit the application of polyester film in some special fields. For example, ordinary polyester film contains a relatively high content of oligomers in the film and on the film surface, which cannot meet the requirements for the use of flexible circuit boards. [0003] In the production process of PET film, oligomers are by-products with a degree of polymerization less than 10 generated during the degradation process of polyester raw material polymerization a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G63/183C08G63/78C08G63/90C08L67/02C08J5/18
CPCC08G63/183C08G63/78C08G63/90C08J5/18C08J2367/02Y02P20/54
Inventor 田立斌赵富王淑生刘伯骏王晶李继庆赵一飞唐蓓赵松穆倩
Owner TIANJIN WANHUA CO LTD
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