Carbon nanotube thermal interface material as well as preparation method and application thereof

Abstract

The invention relates to a carbon nanotube thermal interface material as well as a preparation method and application thereof, and particularly discloses a vertical alignment carbon nanotube thermal interface material which comprises vertical alignment carbon nanotube arrays and a packaging material dispersed among the carbon nanotube arrays. The preparation method comprises the following steps: arranging temporary glue at the free end of the carbon nanotube array, separating the carbon nanotube array, and removing the temporary glue after filling the packaging material. The invention provides the method for transferring the carbon nanotube array growing on the substrate, the thermal interface material is prepared by using the transferred carbon nanotube array, the preparation method is simple, and the obtained thermal interface material is novel in structure, high in thermal conductivity, flexible and suitable for high-heat-yield electronic products and flexible electronic products.

Description

technical field [0001] The invention relates to the field of electronic packaging materials, in particular to a surface-designable carbon nanotube thermal interface material and a preparation method and application thereof. Background technique [0002] In the field of electronic packaging, thermal interface materials are often used to thermally manage components. The contact interface between the heat sink and the component often becomes an obstacle to heat dissipation. The commonly used thermal interface materials at this stage are thermally conductive silica gel / silicon grease / gel, whose thermal conductivity is only 3W / (m·K), which has gradually failed to meet the heat dissipation requirements of high-power devices. Carbon nanotubes are one-dimensional nanomaterials with anisotropic electrical and thermal conductivity due to their unique tubular structure. Among them, the thermal conductivity of carbon nanotubes in the tube axial direction is as high as 2000-6000 W / (m·K...

AI Technical Summary

Problems solved by technology

The above method only considers the transfer process of the carbon nanotube array, and cannot consider the packaging problem in the application process

Secondly, the dry bonding method requires a certain pressure to press, which will destroy the directional structure of the carbon nanotube array.

However, the deposition of metal layers and weak oxidation methods ignore the stability of the application process

[0005] In addition, the oriented structure of vertically oriented carbon nanotube arrays is easily damaged under the action of external force, and reliable packaging is required in the actual application process, while the existing packaging methods for carbon nanotube arrays are basically all Covered packaging, the surface is basically covered by the packaging material, and the coverage of the packaging material often leads to an increase in the surface thermal resistance, which cannot achieve the purpose of the application

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