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Tightening treatment method for micro-nano metal paste filling hole and micro-hole filling process

A treatment method, micro-nano metal technology, applied in the direction of nanotechnology, nanotechnology, electric solid devices, etc., to achieve the effect of increasing density, increasing solid content, and improving electrical and thermal conductivity

Pending Publication Date: 2022-02-25
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, in the blind hole filling process of circuit substrates and carrier boards, there is no technology using nano-metals (micro-nano metals) as filling materials; in order to allow nano-metals to be better applied to micro-holes of circuit substrates In the field of filling, it is necessary to propose a compaction treatment method to improve the efficiency and accuracy of the micropore filling process

Method used

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  • Tightening treatment method for micro-nano metal paste filling hole and micro-hole filling process
  • Tightening treatment method for micro-nano metal paste filling hole and micro-hole filling process
  • Tightening treatment method for micro-nano metal paste filling hole and micro-hole filling process

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Embodiment 1

[0048] see Figure 1-Figure 2 , the present embodiment discloses a compaction processing method for filling holes with micro-nano metal paste, comprising the following steps:

[0049](1) Fix the sample substrate 3 on the substrate fixture 8; first coat and fill the micro-nano metal paste 1 on the surface of the to-be-filled hole 2 of the sample substrate 3, and then carry out the Vacuum treatment makes the micro-nano metal paste 1 quickly flow into the to-be-filled hole 2 under the conditions of its own tension and pressure difference. Of course, the holes 2 to be filled on the sample substrate 3 can also be evacuated first, so that the gas in the holes 2 to be filled overflows, and then the micro-nano metal paste 1 is coated and filled on the surface of the holes 2 to be filled, so as to The infiltration of the micro-nano metal paste 1 is realized.

[0050] (2) The micro-nano metal paste 1 in the sample substrate 3 or the to-be-filled hole 2 is acted upon by an external ins...

Embodiment 2

[0053] see figure 1 and image 3 The difference between this embodiment and Embodiment 1 is that in step (2), the impact load is generated on the sample substrate 3 by the impact device 10, so that the micro-nano metal paste 1 has the ability to move to the bottom of the hole 2 to be filled. Therefore, the micro-nano metal paste 1 and the to-be-filled hole 2 move relative to each other, thereby realizing the compaction of the micro-nano metal paste 1 . In addition, the rigidity of the material of the sample substrate 3 cannot be too large to ensure that the substrate will not be damaged after being impacted.

[0054] see image 3 , and further, the sample substrate 3 is placed horizontally, and the impact device 10 generates an upward impact load on the sample substrate 3 from bottom to top, so that the micro-nano metal paste 1 has an acceleration to move to the bottom (downward) of the hole 2 to be filled, thereby Move to the bottom of the hole to be filled 2 to realize th...

Embodiment 3

[0056] The difference between this embodiment and Embodiment 2 is that the impact device 10 generates a downward impact load on the sample substrate 3 from top to bottom, and then pushes the micro-nano metal paste 1 to move to the bottom of the hole to be filled 2 through an emergency stop. The acceleration (the inertial force of downward movement), so as to move to the bottom of the hole to be filled 2 to realize the compaction of the micro-nano metal paste 1 .

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Abstract

The invention discloses a compaction treatment method for filling holes with micro-nano metal paste and a micropore filling process, and the compaction treatment method comprises the following steps: (1) enabling gas in the holes to be filled to overflow through vacuumizing, and promoting the micro-nano metal paste to permeate into the holes to be filled; (2) generating an acting force on the sample substrate or the micro-nano metal paste in the to-be-filled hole through an external instrument, so the micro-nano metal paste in the to-be-filled hole is accelerated to move towards the bottom of the to-be-filled hole, and compaction treatment is achieved. According to the compaction treatment method disclosed by the invention, compaction treatment is carried out on the micro-nano metal paste on the sample substrate, so that the micro-nano metal paste filled in the to-be-filled hole can be more closely and compactly filled in the to-be-filled hole, and the compactness of a through hole and a blind hole (to-be-filled hole) and the quality after hot pressing sintering are improved. According to the micropore filling process, a dry and wet mixed filling mode is adopted, the electric conduction and heat conduction performance of the to-be-filled holes is effectively improved, and the problems of holes and clamping openings are solved.

Description

technical field [0001] The invention relates to the technical field of circuit substrate filling, in particular to the compaction treatment and micropore filling process of micro-nano metal paste filling. Background technique [0002] As one of the core technologies of semiconductor and integrated circuit manufacturing, the hole-filling technology of the carrier plate can obtain through-hole and blind-hole interconnection structures, which has the advantages of reducing delay, reducing energy consumption, and improving integration. At present, the realization of through-hole and blind-hole interconnection structures is mainly based on electroplating copper hole filling technology; however, such a hole-filling method is prone to defects such as hole filling and clip filling, and has the effect of affecting the conduction of through-hole and blind-hole holes. Thermal conductivity and thermal expansion coefficient mismatch and other issues. [0003] Nano metal has the advantag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498B82Y30/00B82Y40/00
CPCH01L21/486H01L23/49827H01L23/49866B82Y30/00B82Y40/00
Inventor 杨冠南罗波范超钟朝彬崔成强张昱
Owner GUANGDONG UNIV OF TECH
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