Welding flux for welding ultra-small spacing element, preparation method and welding method

A welding method and small-pitch technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problem of short-circuit of ultra-fine-pitch components, reduce the risk of short-circuit, improve the production process capability of the industry, and ensure semiconductor The effect of product packaging

Inactive Publication Date: 2021-11-26
江苏芯德半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Purpose of the invention: In order to solve the problem of short circuit easily caused in the welding of ultra-small pitch components in the prior art, the present invention provides a solder for ultra-fine pitch component welding and its preparation method and welding method

Method used

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  • Welding flux for welding ultra-small spacing element, preparation method and welding method
  • Welding flux for welding ultra-small spacing element, preparation method and welding method
  • Welding flux for welding ultra-small spacing element, preparation method and welding method

Examples

Experimental program
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Effect test

Embodiment 1

[0022] An ultra fine pitch solder element for welding, comprising 5 parts by weight parts of tin powder, 95 parts of ordinary flux.

[0023] The tin powder is Sn96.6Ag3Cu0.5, mixed with one or more other Sn96.5Ag3.5 alloy.

[0024] Common parts by weight of the flux comprises 10 to 20 parts of resin, 5 to 10 parts of a wetting agent, from 2 to 10 parts thixotropic agent, 40 to 70 parts solvent, lactic --10 to 15 parts glycolic acid copolymer, monophosphate esters of 3 to 6 parts.

[0025] Welding ends of individual elements do not provide sufficient solder, solder of the present application provides the added tin powder can complement solder trace.

[0026] Resin is extracted from the secretions of trees belonging to the natural non-corrosive product, presenting activity in the liquid plays the role of flux.

[0027] Wetting agent lowers the surface tension of the flux, increasing affinity and wettability of the solder powder butt pad.

[0028] Thixotropic agents capable of impart...

Embodiment 2

[0041] According to a second embodiment of the first embodiment except that, for ultra fine pitch solder welding element, comprising in parts by weight 10 parts tin powder, 90 parts of ordinary flux. Production method: 10 parts by weight of tin powder in 90 parts by weight of a common flux, was stirred evenly. Other parts are the same as first embodiment. Highly integrated products 4 01005 practical embodiment headto head element and ultra fine pitch (70um), using the present example solder stencil printing experiment 40um thickness by welding method according to the present embodiment, the actual production of solder shorts reduced 10ppm or less.

Embodiment 3

[0043] The third embodiment of the first embodiment except that, for ultra fine pitch solder element welding, parts by weight tin powder comprising 7 parts, 93 parts of ordinary flux. Production method: 7 parts by weight of tin powder in 93 parts by weight of a common flux, was stirred evenly. Other parts are the same as first embodiment. Highly integrated products 4 01005 element and an actual head tohead ultra fine pitch (70um), using the present example solder stencil printing experiment 40um thickness by welding method according to the present embodiment, the actual production of solder shorts reduced 10ppm or less.

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Abstract

The invention discloses a welding flux for welding an ultra-small spacing element, a preparation method and a welding method. The welding flux comprises the following components in parts by weight: 5-10 parts of tin powder and 90-95 parts of common soldering flux, and the welding method comprises the steps of printing, mounting, reflow soldering and the like. The content of tin powder contained in the solder is very low, the short circuit risk can be effectively reduced during welding, the effect of improving the surface mounting short circuit of the ultra-small spacing element is very obvious, semiconductor product packaging is effectively guaranteed, and the industrial production process capacity is improved.

Description

Technical field [0001] The present invention belongs to the technical field of semiconductor packaging and testing, in particular, it relates to a method for manufacturing an ultra-small solder spacing elements for welding, and welding method. Background technique [0002] With the technological development of the semiconductor industry, packaging and testing miniaturized surface element spacing used as a solder paste, a major short circuit defects after reflow. [0003] Existing surface mount technology following steps: a first step, solder paste printing; a second step, the surface mount component placement position corresponding to the printed solder paste; a third step, the surface mount reflow soldering process using the substrate element form solder pads. Paste used in the prior art and flux powder mainly composed of tin, tin powder content of about 85% to 90%, as a Sn96.6Ag3Cu0.5, Sn96.5Ag3.5 like alloy; flux content of about 10% to 15%. [0004] When the spacing between t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/14B23K1/00
CPCB23K35/262B23K35/362B23K35/025B23K1/0008B23K2101/42
Inventor 潘明东张中陈益新徐海
Owner 江苏芯德半导体科技有限公司
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