A stacked material receiving device for lead frame and its working method

Abstract

The invention discloses a stacked material receiving device for a lead frame and a working method thereof, comprising a conveying mechanism and a material-integrating mechanism, the conveying mechanism includes a conveying platform, and a conveying groove is opened at the center of the top of the conveying platform, and the conveying mechanism One end of the inner wall of the conveying trough is fixedly installed with a material guide conveyor belt, the whole material mechanism includes a whole material box, the middle part of the inner wall of the whole material box is fixedly installed with a stacking unit, and the output end of the stacking unit is correspondingly arranged with an outlet A material conveyor belt, one end of the whole material box is provided with a material outlet; a stacked material receiving device for a lead frame and a working method thereof provided by the present invention have a fast overall production speed and can automatically complete the lead frame Encapsulation avoids the trouble of resetting the packaging process and improves the overall production efficiency; by setting up structures such as placing plates and monolithic conveyor belts, the lead frames that have been packaged and collected are stored in a centralized manner to facilitate subsequent processing and transportation.

Description

technical field [0001] The invention relates to a lead frame production equipment, in particular to a stacked material receiving device for a lead frame and a working method thereof. Background technique [0002] The lead frame is the basic material of semiconductor packaging, the carrier of integrated circuit chips, and a key structural component that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials, forming an electrical circuit. The bridge function of the wire connection, most of the semiconductor integrated blocks need to use the lead frame, which is an important basic material in the electronic information industry. The main material for producing lead frame is copper alloy. Take the copper alloy sheet and punch it through the convex and concave dies of the punching die to form a semi-finished lead frame to realize the production of high-density and multi-pin lead frame. After th...

AI Technical Summary

Problems solved by technology

[0003] When the lead frame is received in the production line, it is manually received and sorted. The complete manual operation consumes a lot of manpower, and the production efficiency is low. After completing the sorting and receiving, an additional counting and packaging process of the lead frame is required. The counting operation of manual operation is complicated, which further reduces the production efficiency, and cannot meet the requirements of modern factories to improve the automation level and production efficiency.

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