Shell assembly, preparation method thereof and electronic equipment

Abstract

The invention discloses a shell assembly, a preparation method thereof and electronic equipment. The housing assembly comprises a housing base body; a bottom coating which is located on one side of the shell base body, wherein the bottom coating comprises a first bottom coating body, the first bottom coating body comprises a first resin base body and first inorganic ceramic particles dispersed in the first resin base body, and based on the total mass of the first bottom coating body, in percentage by mass, the mass fraction of the first inorganic ceramic particles is 5-20%; and a ceramic-imitating coating which is positioned on one side, far away from the shell base body, of the bottom coating. Therefore, the binding force between the ceramic-imitating coating and the shell base body can be remarkably improved through the arrangement of the bottom coating, and then the reliability of the shell assembly is improved; in addition, the ceramic-imitating coating can enable the shell assembly to present the appearance of ceramic and the texture of gentle and humid jade.

Description

technical field [0001] The present application relates to the field of electronics, in particular, to a housing assembly, a manufacturing method thereof, and an electronic device. Background technique [0002] With the development and progress of materials and process technology, the appearance of terminals such as mobile phones has also attracted more and more attention from researchers and consumers. Ceramic materials have many advantages, such as high hardness, high toughness, gentle texture like jade, etc., and are loved by more and more consumers. At present, structural parts made of ceramic materials have been applied to various mobile phones (such as mobile phone casings, etc.) Long, sintering, CNC and other processing time are long; 2) The production cost is high, a set of ceramic battery cover requires at least hundreds of yuan in process costs, and the production capacity is limited; 3) The density of ceramic materials is high (taking zirconia ceramics as an examp...

AI Technical Summary

Problems solved by technology

At present, structural parts made of ceramic materials have been applied to various mobile phones (such as mobile phone casings, etc.) Long, sintering, CNC and other processing time are long; 2) The production cost is high, a set of ceramic battery cover requires at least hundreds of yuan in process costs, and the production capacity is limited; 3) The density of ceramic materials is high (taking zirconia ceramics as an example, its density 5.6~5.9g / cm3), which is not conducive to the thinning and thinning of consumer electronics; 4) The dielectric constant Dk value of ceramics is >20, which increases the performance loss of mobile phone 5G antennas

[0003] Therefore, the current housing components and their manufacturing methods and electronic devices still need to be improved

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