Packaging resin composition for surface acoustic wave device, laminated body, and preparation method

A technology of encapsulating resin and surface acoustic wave, applied in the direction of synthetic resin layered products, lamination devices, chemical instruments and methods, etc., can solve the problem of deteriorating surface acoustic wave filter insertion loss, unable to meet the heat dissipation requirements of electronic devices, packaging materials Poor shielding performance and other issues, to achieve the effect of improving electromagnetic shielding characteristics, improving power tolerance, and excellent heat dissipation

Pending Publication Date: 2021-11-16
北京超材信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For RF modules such as filters and duplexers, the heat generation of 5G RF modules is 2-3 times that of 4G RF modules, and the thermal conductivity of conventional epoxy resin-based packaging materials is only 0.2W / (m·K), which cannot meet Thermal requirements of electronic devices
[0003] In addition, the surface acoustic wave device in the prior art has disadvantages such as large volume, high insertion loss, and large square coefficient in the 5G frequency band, and the poor shielding performance of the packaging material will deteriorate the insertion loss of the surface acoustic wave filter.

Method used

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  • Packaging resin composition for surface acoustic wave device, laminated body, and preparation method
  • Packaging resin composition for surface acoustic wave device, laminated body, and preparation method
  • Packaging resin composition for surface acoustic wave device, laminated body, and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Such as figure 2 with Figure 4 As shown, the packaging resin composition (105) involved in this embodiment includes: a resin matrix (105-1) and a filler, wherein the resin matrix includes epoxy resin and epoxy resin curing agent, and the filler includes a thermally conductive filler (105 -21) and shielding filler (105-22), the thermal conductivity of the thermally conductive filler at 25°C exceeds 2W / (m·K), and the electrical conductivity of the shielding filler at 25°C exceeds 10 2 S / m, the mass percentage of the shielding filler and the thermal conductive filler in the encapsulation resin composition is 40-70%.

[0054] The thermal conductivity of the above-mentioned encapsulating resin composition and thermally conductive filler was measured at a temperature of 25° C. using a thermal conductivity meter.

[0055] The shielding performance of the above packaging resin composition is measured based on the near-field shielding effectiveness method in the frequency rang...

Embodiment 2

[0081] The following components of the encapsulation resin composition are by mass percentage:

[0082] (1) Epoxy resin: bisphenol A type epoxy resin, 35%

[0083] (2) Epoxy resin curing agent: acid anhydride, 15%

[0084] (3) Thermally conductive filler: spherical alumina with a particle size of 200nm, 40%

[0085] (4) Shielding filler: dendritic copper powder with a particle size of 500nm, 10%

[0086]First put the epoxy resin, epoxy resin curing agent, thermally conductive filler, and shielding filler into the mixer, and mechanically stir and mix at a speed of 500 rpm for 15 minutes. The above mixture was then put into a twin-screw extruder, melt-extruded and granulated at 150° C. to obtain an encapsulating resin composition for surface acoustic wave devices.

[0087] The performance of the obtained encapsulating resin composition for surface acoustic wave devices is as follows after testing:

[0088] Density: 1.08g / cm 3 ;

[0089] Thermal conductivity: 3.3W / (m·K);

...

Embodiment 3

[0093] The following components of the encapsulation resin composition are by mass percentage:

[0094] (1) Epoxy resin: bisphenol A type epoxy resin, 30%

[0095] (2) Epoxy resin curing agent: acid anhydride, 10%

[0096] (3) Curing catalyst: 5%

[0097] (4) Toughening agent: core-shell structure of styrene-butadiene copolymer coated on the outside of styrene-acrylic block copolymer, particle size is 500nm, 5%

[0098] (5) The first thermally conductive filler: spherical AlN with a particle size of 300nm, 20%

[0099] (6) The second thermally conductive filler: spherical AlN with a particle size of 100nm, 10%

[0100] (7) Shielding filler: dendritic copper powder with a particle size of 500nm, 20%

[0101] First put epoxy resin, epoxy resin curing agent, curing catalyst, toughening agent, first thermally conductive filler, second thermally conductive filler, and shielding filler into a mixer, and mechanically stir and mix at a speed of 500 rpm for 15 minutes. Then the ab...

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Abstract

The invention provides a packaging resin composition for a surface acoustic wave device, a laminated body and a preparation method thereof. The packaging resin composition comprises a resin matrix and filler; the resin matrix comprises epoxy resin and an epoxy resin curing agent; the filler comprises a heat-conducting filler and a shielding filler; the heat conductivity of the heat-conducting filler at 25 DEG C exceeds 2W / (m.K), the electric conductivity of the shielding filler at 25 DEG C exceeds 10<2>S / m, and the mass percent of the shielding filler and the heat-conducting filler in the packaging resin composition is 40-70%. The packaging resin composition for the surface acoustic wave device provided by the invention not only can ensure that the packaging resin has excellent heat dissipation performance, but also can reduce the insertion loss of the surface acoustic wave device by forming a continuous shielding structure, and can meet the requirements of the high-frequency and high-power surface acoustic wave device on comprehensive properties such as high thermal conductivity and low insertion loss.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an encapsulating resin composition for encapsulating a surface acoustic wave device, a laminate and a preparation method thereof. Background technique [0002] With the rapid development of radio frequency technology, the requirements for the frequency index of surface acoustic wave devices such as filters, duplexers and other radio frequency modules are becoming increasingly stringent, requiring larger bandwidth, higher frequency, and higher power surface acoustic wave devices to To meet the increasing amount of information transmission and wide frequency bandwidth, but at the same time, the requirements for volume are becoming more and more stringent, and the volume must be developed towards "miniaturization". How to quickly and effectively dissipate the internal heat of RF modules such as filters and duplexers has become a bottleneck problem in electronic device pack...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L25/10C08L53/00C08K7/18C08K7/00C08K3/22C08K3/08C08K3/28C08K3/04C08K9/06C08K3/34B32B27/38B32B27/18B32B27/06B32B37/06B32B37/10B32B38/00B32B37/00
CPCC08L63/00C08K7/18C08K7/00C08K3/22C08K3/08C08K3/34C08K3/28B32B27/38B32B27/18B32B27/08B32B37/06B32B37/10B32B38/00B32B37/003C08K2003/2227C08K2003/085C08K2201/011C08L2207/53C08K2201/014C08K2003/282C08L2203/206B32B2038/0064B32B2250/24B32B2307/212B32B2307/302C08L25/10C08L53/00C08K9/06C08K3/042
Inventor 王阳吴洋洋曹庭松陆彬
Owner 北京超材信息科技有限公司
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