Insulating material vacuum encapsulation device and method for traveling wave tube heater assembly

Abstract

The invention discloses an insulating material vacuum encapsulation device and method for a traveling wave tube heater assembly, and belongs to the field of sealing and filling processes of solid-liquid mixed materials. The insulating material vacuum encapsulation device for the traveling wave tube heater assembly comprises an organic glass bell jar, and the organic glass bell jar comprises an upper cover and a lower cover; and a sealing rubber ring is arranged between the contact surfaces of the upper cover and the lower cover, an exhaust port is formed in the bottom of one side of the lower cover, the exhaust port is connected with a vacuum pump through a rubber pipe, a template clamping groove is formed in the lower cover, and a sample placing template is clamped and fixed in the template clamping groove. The device is simple in structure, low in cost and easy to operate, and the heater assembly mold material is easy to obtain and easy to design and manufacture. And synchronous densification treatment of multiple and various heater assembly fillers can be realized through cooperative use of the two, so that the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of sealing and potting of solid-liquid mixed materials, and more specifically relates to a device and method for vacuum sealing and potting of insulating materials for thermal sub-assemblies of traveling wave tubes. Background technique [0002] Traveling wave tubes are widely used in radar, electronic countermeasures, communications and other fields as the core device for microwave power amplification. The cathode thermal subassembly is an important part of the TWT, and its performance and working state will directly affect the performance and working state of the device. The cathode thermal subassembly is widely used to heat the cathode through the heat conduction of the insulating filling material, so that the kinetic energy of the electrons inside the cathode is increased, and the surface barrier is overcome to escape the solid surface, forming electron emission; the process is to combine alumina and oth...

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Problems solved by technology

[0003] (1) After the filler is injected into the cathode cylinder, use a centrifuge to make the filler more compact, which will inevitably lead to the stratification of filler particles with different diameters, and the phenomenon of uneven shrinkage of the filler block after sintering will affect the reliability of the thermal subassembly sex

[0004] (2) If the liquid phase and entrapped gas in the filler are not discharged in time, defects such as holes and surface cracks will appear inside the filler during the high-temperature sintering stage, which will seriously affect the thermal shock resistance, insulation performance and thermal efficiency of the thermal subassembly

[0005] (3) The process from filler injection to cathode cylinder to centrifugation takes a long time, and most of them process a single component at a time, which leads to high time cost and low production efficiency for the production of a single component

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