Method and device for optimizing photoetching process, and computer storage medium

Abstract

The invention can provide a method and a device for optimizing a photoetching process, and a computer storage medium. The method comprises the following steps: acquiring data of a target photoresist, wherein the data of the target photoresist comprises photoresist spatial data and photoresist component data; and segmenting the space occupied by the target photoresist according to the photoresist spatial data to determine a plurality of unit blocks, wherein each unit block is provided with lattice points; determining original state information of each lattice point position on the target photoresist according to the photoresist component data, and determining current state information of each lattice point position on the exposed target photoresist according to preset process parameters and the original state information; and predicting the morphology of the developed target photoresist through the current state information. The morphology of the developed photoresist can be predicted in advance so as to guide and optimize an actual photoetching process, research and development of new varieties or new types of photoresists are facilitated, the research and development progress is promoted, and the research and development cost is reduced.

Description

technical field [0001] The invention relates to the technical field of photolithography technology, and more specifically, the invention can provide a method and device for optimizing a photolithography technology, and a computer storage medium. Background technique [0002] With the evolution of IC technology, shrinking IC technology nodes is facing more and more challenges. Among them, the photolithography process is an indispensable key technology in the entire integrated circuit manufacturing process. The reduction of technology nodes requires photolithography to transfer smaller and smaller circuit patterns to photoresist to manufacture transistors of smaller size and increase the number of transistors per unit area. The core process of the photolithography process may include: applying photoresist on the substrate, and letting the light emitted by the light source pass through the mask and then irradiate the photoresist, so that photochemical reactions and other chemi...

AI Technical Summary

Problems solved by technology

[0003] Forming the required pattern on the photoresist is the fundamental and key of the photolithography process, but due to the limitations of the existing technology, it often takes a lot of experiments and attempts to determine the suitable photoresist and process conditions, which not only affects the photolithography process The research and development progress, at the same time need to invest a lot of manpower and material resources

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