Red high-thixotropy UV adhesive for manufacturing washers and preparation method thereof

A high thixotropic, red technology, applied in the field of UV glue, can solve the problems of difficult prefabricated solid sealing rings, etc., and achieve the effects of excellent elasticity and sealing performance, reasonable formula ratio, and low hardness

Pending Publication Date: 2021-10-26
连云港华海诚科电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in some personalized sealing requirements, such as intricate interfaces, flat surfaces or grooves with wide surface but shallow depth, it is difficult to prefabricate solid sealing rings

Method used

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  • Red high-thixotropy UV adhesive for manufacturing washers and preparation method thereof
  • Red high-thixotropy UV adhesive for manufacturing washers and preparation method thereof
  • Red high-thixotropy UV adhesive for manufacturing washers and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Embodiment 1, preparation method one for making the red high thixotropic UV glue of gasket:

[0057] Raw material composition:

[0058] Polyurethane acrylic resin 46%;

[0059] 2,4,6(trimethylbenzoyl)diphenylphosphine oxide 0.25%;

[0060] 1-Hydroxycyclohexyl phenyl ketone 1%;

[0061] N,N-dimethylacrylamide 5%;

[0062] 2-phenoxyethyl acrylate 30%;

[0063] Tetrahydrofuran acrylate 12.1%;

[0064] Phosphodiester methacrylate 0.5%;

[0065] Fumed silica 5%;

[0066] Pigment Red 171 (PR171) 0.15%;

[0067] Preparation method: Add the raw materials in the above proportions into the stirring tank one by one, stir evenly, vacuumize to remove air bubbles, and store in the dark after packaging.

Embodiment 2

[0068] Embodiment 2, the preparation method two of the red high thixotropic UV glue that is used to make gasket:

[0069] Raw material composition:

[0070] Polyurethane acrylic resin 42%;

[0071] 2,4,6(trimethylbenzoyl)diphenylphosphine oxide 0.25%;

[0072] 1-Hydroxycyclohexyl phenyl ketone 1 %;

[0073] N,N-dimethylacrylamide 4%;

[0074] Lauryl acrylate 8%;

[0075] 2-phenoxyethyl acrylate 38%;

[0076] Phosphodiester methacrylate 0.5%;

[0077] After the above raw materials are added to the stirring tank and stirred evenly, add 6% of fumed silica and 0.25% of Pigment Red 171 (PR171), stir evenly, vacuumize to remove air bubbles, pack and store away from light.

Embodiment 3

[0078] Embodiment 3, the preparation method three of the red high thixotropic UV glue that is used to make gasket:

[0079] Raw material composition:

[0080] Polyurethane acrylic resin 37%;

[0081] 2,4,6(trimethylbenzoyl)diphenylphosphine oxide 0.2%;

[0082] 1-Hydroxycyclohexyl phenyl ketone 0.8 %;

[0083] N,N-dimethylacrylamide 4.3%;

[0084] Lauric acid acrylate 8.6%;

[0085] Hydroxybutyl acrylate 12.35%;

[0086] 2-phenoxyethyl acrylate 30%;

[0087] Phosphodiester methacrylate 0.5%;

[0088] Put the above raw materials into the stirring tank one by one, stir well, add fumed silica 6%, pigment red 171 (PR171) 0.25%, stir well, vacuumize to remove air bubbles, pack and store away from light.

[0089] The red highly thixotropic UV obtained in Examples 1-3 was used for related tests, and the results are as follows:

[0090] Table 1 Tensile test results of cured strips at room temperature

[0091]

[0092] The cured sample was tested at 85°C, 85%RH, and 120h. T...

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PUM

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Abstract

The invention relates to a red high-thixotropy UV adhesive for manufacturing washers. The UV adhesive is prepared from the following raw materials in percentage by weight: 35-70% of prepolymer, 0.5-3% of a photoinitiator, 25-60% of a UV reactive diluent, 0.5-8% of gas phase powder, 0.1-1% of a red pigment, and 0.1-1% of an adhesion promoter. The red high-thixotropy UV adhesive for manufacturing the wafers is reasonable in formula proportion, and the prepared sealing wafer is excellent in elasticity and sealing performance and still keeps elasticity, strength and adhesive strength under the environment of high temperature (150 DEG C, 4 h) and high temperature and high humidity (85 DEG C / 85% RH). The red high-thixotropy UV adhesive is low in hardness and high in elongation after being cured. And the application scenarios requiring buffering and flexible bonding in the field of electronic materials can be met.

Description

technical field [0001] The invention relates to a UV glue, in particular to a red high thixotropic UV glue used for making gaskets, and also relates to a preparation method of the red high thixotropy UV glue. Background technique [0002] Gaskets can be used in various products such as automobiles, electrical and electronic components, hardware and plastics, etc., to seal various media such as sewage and lubricating oil. Among them, the solid rubber sealing ring is the most widely used and mature product. With the emergence of UV-curable sealing ring technology, more and more manufacturers choose UV-forming gaskets as an alternative process, especially in the field of electronic devices. This technology has fast curing and molding speed, no complicated baking process, and good bonding / sealing to various substrates. [0003] Moisture curing molded sealing ring refers to the assembly of the workpiece in an uncured state after the base material is coated with a sealant. Afte...

Claims

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Application Information

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IPC IPC(8): C08F283/00C08F220/54C08F220/30C08F220/32C08F230/02C08K3/36
CPCC08F283/008C08K3/36C08F220/54C08F220/301C08F220/32C08F230/02
Inventor 王明清秦苏琼陶军徐丹丹王志封昌红袁兴菊陶腾腾
Owner 连云港华海诚科电子材料有限公司
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