Broadband photoelectric detector based on graphene homojunction and preparation method of broadband photoelectric detector
A photodetector and graphene technology, applied in the field of photoelectric detection, can solve the problems of slow response time, uncontrollability, high responsivity of graphene photodetector, etc., achieve high mobility and improve separation efficiency
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Embodiment 1
[0035] This embodiment is a broadband photodetector based on graphene homojunction. The structure of the photodetector includes an SOI substrate, graphene strips and electrodes, the graphene strips are covered on the substrate, the SOI substrate includes silicon and silicon oxide, and the two electrodes are connected by the graphene strips and arranged separately There are two metal electrodes above the two ends of the graphene strip, and there are periodically parallel channels on the substrate surface, such as figure 1 shown.
[0036] From top to bottom, the substrate includes doped top silicon with a thickness of 220nm, silicon oxide with a thickness of 2μm, and lightly doped bottom silicon with a thickness of 450μm. The surface of the substrate is divided into a lightly doped top silicon region and a silicon oxide region. These two regions Periodically alternately arranged in parallel to form a channel, the arrangement periods are 300nm, 600nm, 800nm, 1200nm, 3μm and 10μm...
Embodiment 2
[0044] This embodiment is a preparation method of a broadband photodetector based on a graphene homojunction, and its preparation process is substrate preparation, substrate etching, graphene growth, graphene transfer, metal electrode preparation, and graphene striping ,Such as Figure 4 shown.
[0045] Substrate preparation, in this embodiment, the structure from top to bottom is lightly doped top silicon with a thickness of 220 nm, silicon oxide with a thickness of 2 μm, and a lightly doped bottom silicon SOI substrate with a thickness of 450 μm. Before use, the substrate was cleaned by ultrasonication with acetone and ethanol for 20 min.
[0046] For substrate etching, 475PMMA is used as photoresist, and electron beam direct writing is used as exposure method to write grating patterns of different periods on the top silicon surface. A 30nm chromium layer is evaporated on the substrate surface, and the top silicon layer in the unexposed area is exposed after peeling off, a...
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