Testing equipment and method for testing single board

Abstract

An embodiment of the invention discloses testing equipment and method for testing a single board, and belongs to the technical field of testing. The testing equipment comprises a processor, a function test component and a hardware test component, wherein the function test component tests function test items of the single board to be tested and sends test results of the function test items to the processor; the hardware test component tests the voltage at the test point of the single board to be tested and sends the voltage at the test point to the processor; and the processor determines a fault circuit area according to a test result of the function test items and a pre-stored corresponding relation between the function test items and circuit areas, determines a fault test point according to the voltage at the test point and a pre-stored corresponding relation between the test point and a standard voltage, and determines a device position number corresponding to the fault test point according to a pre-stored corresponding relationship between the test point and the device position number. By adopting the testing equipment and method, the first pass yield of module production can be improved, the module production period can be shortened, and the module maintenance cost can be saved.

Description

technical field [0001] The present application relates to the technical field of testing, in particular to a testing device and method for testing a single board. Background technique [0002] In the mass production of veneers, due to various possible factors of equipment and operators, it is impossible for all veneers produced to be qualified. Therefore, the processed veneer needs to be tested before assembly work. [0003] In-circuit test (ICT) is a relatively common test method, which can test the quality of the components installed on the board. For example, it can test the capacitance, resistance, and inductance installed on the board. Whether components such as diodes and triodes are in good condition. [0004] However, after passing the on-line test of the board and assembling it into a module, there may still be situations where the board cannot perform some functions. At this time, the module needs to be disassembled for maintenance, resulting in a low pass-throug...

AI Technical Summary

Problems solved by technology

[0004] However, after passing the on-line test of the single board and assembling it into a module, there will still be situations where the single board cannot realize some functions. At this time, the module needs to be disassembled for maintenance, resulting in a low pass-through rate of the production equipment module.

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