Cuttage type insulating glue pressing process based on copper substrate

Abstract

The invention discloses a cottage type insulating glue pressing process based on a copper substrate, and belongs to the technical field of copper substrates, and the cottage type insulating glue pressing process can enable a plurality of cottage columns to be uniformly adsorbed on the back of a copper foil in a manner that the cottage columns are dipped with wax liquid and then are cured and adsorbed on the back of the copper foil before the copper foil and a metal base layer are pressed; then the copper foil and the metal base layer are pressed, the cutting column is inserted into the insulation paste to form a gas leakage channel, most of gas contained in the insulation paste is released, and meanwhile, in the heating and curing process of the insulation paste, cured wax is molten again and enters a gap of the gas leakage channel; and the residual gas is expelled to the upper side by utilizing the characteristic that the surface tension is relatively large, in addition, a magnetic field applied below the metal base layer also synchronously triggers the bottom end expansion action of the cuttage column, the pre-stored insulation paste is released to ensure the density and the fullness of the cuttage column while the gas extrusion is continuously deepened, and the bonding strength of the cuttage column and the insulation paste layer is improved.

Description

technical field [0001] The invention relates to the technical field of copper substrates, and more particularly, to a cutting-type insulating adhesive lamination process based on copper substrates. Background technique [0002] Copper substrate is the most expensive metal substrate, and its thermal conductivity is many times better than that of aluminum substrate and iron substrate. [0003] Generally, there are immersion gold copper substrates, silver-plated copper substrates, tin-sprayed copper substrates, and anti-oxidation copper substrates. The circuit layer of the copper substrate is required to have a large current carrying capacity, so thicker copper foil should be used, with a thickness of generally 35μm-280μm; the thermal insulation layer is the core technology of the copper substrate, and the core thermal conductive components are Al2O3 and silicon powder The composition is composed of epoxy resin filled polymers, with low thermal resistance (0.15), excellent vis...

AI Technical Summary

Problems solved by technology

[0004] However, in the actual pressing process of the copper substrate, because the insulating adhesive will inevitably mix a small amount of gas, and due to the problem of uneven pressure, it is easy to generate bubbles or poor appearance in the insulating adhesive layer, resulting in a low yield rate, which not only leads to The strength of the copper substrate is low, and the heat conduction efficiency will be severely reduced at the same time

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