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Preparation method of high-performance polytetrafluoroethylene copper-clad plate

A polytetrafluoroethylene and copper clad laminate technology, applied in chemical instruments and methods, lamination, layered products, etc., can solve problems such as high cost, cost profit margin compression, and limited application

Pending Publication Date: 2021-09-14
CHENZHOU GONGTIAN ELECTRONICS CERAMICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high cost of raw materials and production process limits its application, while the current competition for PTFE glass cloth-based copper clad laminates is becoming more and more fierce, the production methods are becoming more and more uniform, and the cost and profit margins are further compressed

Method used

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  • Preparation method of high-performance polytetrafluoroethylene copper-clad plate
  • Preparation method of high-performance polytetrafluoroethylene copper-clad plate
  • Preparation method of high-performance polytetrafluoroethylene copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Use electronic-grade glass fiber cloth 1080 through a vertical gluing machine and two rubber basins to glue PTFE concentrate, the gluing line speed is 5.5m / min, low temperature 180 ℃ drying, 240 ℃ baking, high temperature 330 ℃ Sintering, automatic tension mode, the squeegee is controlled by the squeegee rod device to obtain the cloth type 1080 (RC42%) PTFE glass cloth-based adhesive sheet;

[0041] Use polytetrafluoroethylene dispersed resin powder to extrude and calender, then bake at 180°C for 5 minutes to obtain pure polytetrafluoroethylene adhesive film, with a width of 47cm and a thickness of 0.33mm;

[0042] A 0.762mm copper-clad laminate with a dielectric constant of 2.10 and a thickness of 0.762mm is prepared by using a glass cloth-based 1080 adhesive sheet with a weight ratio of 15% and a calendered adhesive film material with a weight ratio of 85% to cover both sides with a 35um inverted electrolytic copper foil.figure 1 shown in the structure;

[0043] The a...

Embodiment 2

[0045] Use electronic-grade glass fiber cloth 106 to glue PTFE concentrate through a vertical gluing machine and two rubber basins. The gluing line speed is 6.0m / min. Dry at low temperature at 180°C, bake at 240°C, and high temperature at 330°C Sintering, automatic tension mode, the squeegee is controlled by the squeegee rod device to obtain the cloth type 106 (RC51%) PTFE glass cloth-based adhesive sheet;

[0046] Use polytetrafluoroethylene dispersed resin powder to extrude and calender, then bake at 180°C for 5-7 minutes to obtain pure polytetrafluoroethylene adhesive film, with a width of 47cm and a thickness of 0.12mm and 0.33mm;

[0047] A copper clad laminate with a dielectric constant of 2.20 and a thickness of 0.762mm is prepared by using a combination of glass cloth base 106 bonding sheet with a weight ratio of 18% and a calendered adhesive film material with a weight ratio of 82%. figure 2 shown in the structure;

[0048] The above proportions use a hydraulic high...

Embodiment 3

[0050] Use electronic grade glass fiber cloth 1078, 3313 to glue PTFE concentrate through vertical glue machine and two rubber basins, glue line speed is 5.2, 5.0m / min, dry at low temperature 180°C, bake at 240°C , Sintering at a high temperature of 335°C, automatic tension mode, controlling the squeegee through the squeegee rod device to obtain fabric types 1078 (RC46%), 3313 (RC40%) PTFE glass cloth-based adhesive sheets;

[0051] Use polytetrafluoroethylene dispersed resin powder to extrude and calender, then bake at 180°C for 5-7 minutes to obtain pure polytetrafluoroethylene adhesive film, with a width of 47cm and a thickness of 0.07mm, 0.22mm, and 0.33mm;

[0052] The dielectric constant is 2.55 and the thickness is 0.762, which is prepared by using glass cloth base 1078 bonding sheet with a weight ratio of 13%, 3313 bonding sheet with a weight ratio of 15%, and a calendered adhesive film with a weight ratio of 72%. mm copper clad laminate, match as follows image 3 sho...

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Abstract

The invention discloses a preparation method of a high-performance polytetrafluoroethylene copper-clad plate. The preparation method comprises the following steps: firstly, dipping electronic-grade glass fabric into polytetrafluoroethylene emulsion to obtain a polytetrafluoroethylene glass fabric-based bonding sheet; extruding and calendering a wide base film by using polytetrafluoroethylene dispersion resin powder to obtain a pure polytetrafluoroethylene adhesive film material; and performing double-sided copper foil coating on a polytetrafluoroethylene glass fabric-based bonding sheet with the weight ratio of 15-80% and a polytetrafluoroethylene extrusion calendering bonding film material with the weight ratio of 20-85%, and performing high-temperature vacuum lamination molding to prepare the high-performance polytetrafluoroethylene copper-clad plate. The dielectric constant [epsilon]r of the prepared copper-clad plate at the frequency of 1 G / 10 G ranges from 2.10 to 3.50 and is adjustable. The process provided by the invention can be used for large-scale industrial production, and the prepared combination can improve the RC of the bonding sheet to the maximum extent and reduce the cost.

Description

technical field [0001] The invention relates to the technical field of preparation technology for copper-clad laminates, and more specifically relates to a preparation method of high-performance polytetrafluoroethylene copper-clad laminates. Background technique [0002] Information electronic products are developing toward high frequency, high speed, high precision, and high reliability, and their market demand is growing rapidly. Pure PTFE glass cloth-based copper-clad laminates are mainly produced with emulsion and PTFE cut film as the main material. performance. The high cost of raw materials and production process limits its application. However, the current competition for PTFE glass cloth-based copper clad laminates is becoming more and more fierce, and the production methods are becoming more and more uniform, and the cost and profit margins are further compressed. There is an urgent need for a preparation method that can effectively reduce production costs and mai...

Claims

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Application Information

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IPC IPC(8): B32B15/20B32B15/085B32B15/14B32B17/02B32B17/10B32B27/32B32B27/12B32B38/08B32B37/06B32B37/10
CPCB32B15/20B32B15/085B32B15/14B32B5/02B32B27/322B32B27/12B32B38/08B32B37/06B32B37/1018B32B2262/101B32B2260/021B32B2260/046
Inventor 陈功田陈建李海林邓万能彭灿
Owner CHENZHOU GONGTIAN ELECTRONICS CERAMICS TECH
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