Thermal forming mold and thermal forming method of glass cover plate

A glass cover plate and thermoforming technology, applied in glass forming, glass reshaping, glass production, etc., can solve the problems of complex processing technology, low product yield, complex structure, etc., achieve simple process, improve forming quality Efficient, easy-to-control effects

Pending Publication Date: 2021-09-03
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to enrich the application scenarios of glass parts and improve user experience, glass parts are often processed into 3D structures. Due to the complex structure of glass parts with 3D structures, the processing technology is complicated and the product yield is low.

Method used

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  • Thermal forming mold and thermal forming method of glass cover plate
  • Thermal forming mold and thermal forming method of glass cover plate
  • Thermal forming mold and thermal forming method of glass cover plate

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Embodiment Construction

[0023] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0024] In related technologies, one of the methods for processing 3D glass cover plates is to pre-process multiple pieces of glass, then align and weld the pre-processed multiple pieces of glass to form a 3D glass blank, and finally process the 3D glass blank. Finishing the wall surface to produce a 3D glass cover with a smooth structure; another method of processing the 3D glass cover is to prefabricate the glass into 3D glass, and then mechanically process a complex structure on part of the prefabricated 3D glass. Finally, a 3D glass cover plate of the desired shape is p...

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PUM

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Abstract

The invention discloses a thermal forming mold and method for a glass cover plate. The thermal forming mold comprises a lower mold, a heating mechanism and an upper mold, a first extrusion part and a second extrusion part of the upper mold are arranged to correspondingly act on the middle part and the edge part of to-be-processed glass respectively, extrusion shaping of the to-be-processed glass is completed regionally, so that the glass cover plate with the 3D structure is formed at a time, and the process is simple. The second extrusion part can also push the edge part of the to-be-processed glass into the forming groove from the periphery, so that all parts of the to-be-processed glass can be utilized. In the extrusion process, the wall face of the forming groove, the surface of the first extrusion part and the surface of the second extrusion part act on the surface of the to-be-machined glass in multiple directions, so that all the surfaces of the to-be-machined glass are limited, the shape of the machined glass cover plate is easier to control, product specifications are unified conveniently, and the forming yield is increased.

Description

technical field [0001] The present application relates to the technical field of electronic components, in particular to a thermoforming mold and a thermoforming method for a glass cover plate. Background technique [0002] Electronic products with communication functions such as smartphones and smart watches can transmit and receive wireless signals, and the metal parts in electronic equipment will affect the transmission and reception of signals. Reducing metal parts on electronic products has become a development trend of electronic products. Its crystal clear appearance and plasticity have become a good substitute for metal parts. In order to enrich the application scenarios of glass parts and improve user experience, glass parts are often processed into 3D structures. Due to the complex structure of glass parts with 3D structures, the processing technology is complicated and the product yield is low. Contents of the invention [0003] In order to solve the above prob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B23/03
CPCC03B23/03Y02P40/57
Inventor 周峰李聪
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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