Indirect brazing method for aluminum nitride ceramic copper-clad plate

Abstract

The invention discloses an indirect brazing method for an aluminum nitride ceramic copper-clad plate, and belongs to the technical field of ceramic copper-clad plate manufacturing. The preparation process comprises the following steps: uniformly mixing Ag powder, Cu powder, copper-plated low-expansion ceramic powder and copper-plated graphene powder to prepare composite brazing filler metal, and adding an organic binder into the composite brazing filler metal to prepare composite brazing filler metal slurry; depositing an active metal element Ti, Zr, Hf or Cr on the surface of the aluminum nitride ceramic; and after the composite brazing filler metal is coated on the surface of the aluminum nitride ceramic substrate sputtered with the active elements, making oxygen-free copper sheets compounded on two sides, and making an obtained assembly dried and then put into a vacuum furnace to be brazed. The ceramic particles with the low expansion coefficient are introduced into the brazing filler metal, the thermal expansion coefficient of a connector is in gradient transition, and then the residual stress level of the connector is remarkably reduced. Graphene with high thermal conductivity and high strength is introduced into the composite brazing filler metal, so that the strength of the brazing filler metal can be improved, and the thermal conductivity of the brazing filler metal can be improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing ceramic copper-clad laminates, in particular to an indirect brazing manufacturing method for aluminum nitride ceramic copper-clad laminates. Background technique [0002] Ceramic copper clad laminate is composed of oxygen-free copper and ceramic substrate. It takes into account the high electrical conductivity and high thermal conductivity of oxygen-free copper as well as the high insulation and low expansion of ceramic materials. It is an extremely important electronic packaging material. In the new Energy vehicles, power locomotives, aerospace and other fields have broad application prospects. Aluminum nitride ceramics have outstanding advantages such as high thermal conductivity and good chemical stability, and are commonly used materials for manufacturing high thermal conductivity ceramic copper clad laminates. [0003] At present, the manufacturing methods of aluminum nitride ceramic c...

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Problems solved by technology

[0004] However, due to aluminum nitride ceramics (4.7×10 -6 ℃ -1 ) and oxygen-free copper (18.6×10 -6 ℃ -1 ) There is a large difference in thermal expansion coefficient, and the connection area of ​​the ceramic copper clad laminate is relatively large (common product sizes are 4.5 inches, 6 inches, etc.), and the cold and heat cycle of the ceramic copper clad laminate during use will further lead to residual stress. accumulation

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