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Indirect brazing method for aluminum nitride ceramic copper-clad plate

A technology of aluminum nitride ceramics and brazing method, which is applied in the field of indirect brazing manufacturing of aluminum nitride ceramic copper-clad laminates, can solve the problems of large connection area and residual stress accumulation of ceramic copper-clad laminates, and reduce the level of residual stress and Effect of thermal expansion coefficient

Active Publication Date: 2021-08-27
CHANGCHUN UNIV OF TECH
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  • Application Information

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Problems solved by technology

[0004] However, due to aluminum nitride ceramics (4.7×10 -6 ℃ -1 ) and oxygen-free copper (18.6×10 -6 ℃ -1 ) There is a large difference in thermal expansion coefficient, and the connection area of ​​the ceramic copper clad laminate is relatively large (common product sizes are 4.5 inches, 6 inches, etc.), and the cold and heat cycle of the ceramic copper clad laminate during use will further lead to residual stress. accumulation

Method used

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  • Indirect brazing method for aluminum nitride ceramic copper-clad plate
  • Indirect brazing method for aluminum nitride ceramic copper-clad plate

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Embodiment 1

[0029] 1) The aluminum nitride ceramic substrate was ultrasonically cleaned in acetone for 20 minutes to remove surface oil, and then dried with a hair dryer for later use. Oxygen-free copper sheet with 15wt.% H 2 SO 4 Pickle for 5 minutes to remove the oxide film on the surface, then perform ultrasonic cleaning in acetone for 20 minutes, and use a hair dryer to dry it for later use.

[0030] 2) Prepare composite solder (percentage by weight) according to the following composition: Ag powder: 66%, Cu powder: 24%, copper-plated aluminum nitride powder: 10%, copper-plated graphene powder: 0.2%, aluminum nitride used wherein The diameter of the powder was 1 μm. A mechanical ball milling method is used to fully mix the above-mentioned components to prepare a composite solder. The ball milling speed is 200r / min, and the ball milling time is 4h. A binder whose weight is 5wt.% of the composite solder is added to the composite solder to prepare a slurry.

[0031] The copper-plate...

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Abstract

The invention discloses an indirect brazing method for an aluminum nitride ceramic copper-clad plate, and belongs to the technical field of ceramic copper-clad plate manufacturing. The preparation process comprises the following steps: uniformly mixing Ag powder, Cu powder, copper-plated low-expansion ceramic powder and copper-plated graphene powder to prepare composite brazing filler metal, and adding an organic binder into the composite brazing filler metal to prepare composite brazing filler metal slurry; depositing an active metal element Ti, Zr, Hf or Cr on the surface of the aluminum nitride ceramic; and after the composite brazing filler metal is coated on the surface of the aluminum nitride ceramic substrate sputtered with the active elements, making oxygen-free copper sheets compounded on two sides, and making an obtained assembly dried and then put into a vacuum furnace to be brazed. The ceramic particles with the low expansion coefficient are introduced into the brazing filler metal, the thermal expansion coefficient of a connector is in gradient transition, and then the residual stress level of the connector is remarkably reduced. Graphene with high thermal conductivity and high strength is introduced into the composite brazing filler metal, so that the strength of the brazing filler metal can be improved, and the thermal conductivity of the brazing filler metal can be improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing ceramic copper-clad laminates, in particular to an indirect brazing manufacturing method for aluminum nitride ceramic copper-clad laminates. Background technique [0002] Ceramic copper clad laminate is composed of oxygen-free copper and ceramic substrate. It takes into account the high electrical conductivity and high thermal conductivity of oxygen-free copper as well as the high insulation and low expansion of ceramic materials. It is an extremely important electronic packaging material. In the new Energy vehicles, power locomotives, aerospace and other fields have broad application prospects. Aluminum nitride ceramics have outstanding advantages such as high thermal conductivity and good chemical stability, and are commonly used materials for manufacturing high thermal conductivity ceramic copper clad laminates. [0003] At present, the manufacturing methods of aluminum nitride ceramic c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02
CPCC04B37/023C04B2237/122C04B2237/125C04B2237/408C04B2237/407C04B2237/52
Inventor 朱巍巍唐木冉旭
Owner CHANGCHUN UNIV OF TECH
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