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Glass-containing packaging device and packaging method and application thereof

A technology of glass encapsulation and encapsulation method, which is applied in glass forming, glass pressing, glass manufacturing equipment and other directions, can solve the problems of glass opacity, low glass strength, and difficulty in meeting device reliability requirements, and achieves alleviation of glass opacity and strength. improved effect

Pending Publication Date: 2021-08-27
苏州融睿电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Packaging devices, used in aerospace, microwave communication, and electronic components. With the multi-functional integration, miniaturization, light weight, and device reliability of devices, it is becoming more and more difficult to meet the requirements. The glass thickness of the glass packaging part of traditional packaging devices is 1-6mm , the glass thickness of new devices requires 0.3-0.5mm thickness, and some optical sensors have high requirements for glass transparency, and the traditional glass-metal packaging process is difficult to meet the overall strength requirements
[0003] The existing traditional glass-to-metal packaging process is to add glass powder to the binder to form particles, the particles are pressed into a glass blank through a mold, the blank is heated to discharge the binder, and finally the glass blank and the binder are discharged. The metal is melted and sealed with the metal at a high temperature of 500-1000 degrees to form an integrated device, but the disadvantage of the existing packaging process is that the adhesive cannot be discharged 100% in the miniaturized device, and there are bubbles, foreign objects, and holes in the glass. Etc. The glass blank and the metal are melted and sealed with the metal at a high temperature of 500-1000 degrees to form an integrated device. The bubbles inside the glass will cause the glass to be opaque, and the bubbles, holes, and foreign objects inside the glass will reduce the strength of the glass itself.
[0004] Therefore, a new type of glass-metal packaging method has been researched and developed. The glass-containing packaged device produced by this packaging process has the advantages of high strength and good transparency, which can effectively relieve the existing traditional glass-metal packaging process in the preparation of miniaturized electronic devices. The problem of opaque glass and low glass strength has become very necessary and urgent

Method used

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  • Glass-containing packaging device and packaging method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] A method for encapsulating glass-encapsulated devices, the encapsulation method comprising the following steps:

[0059] 1. Put the glass powder in the crucible, and then put the crucible with glass into the high-temperature furnace vacuum furnace to seal and vacuumize to ensure that the vacuum degree reaches 1×10 -2 Mpa, heated to 800°C until the glass powder in the crucible melts to obtain a glass solution;

[0060] 2. Inject the glass solution into the mold for vacuum compression molding, then cool and anneal to obtain flat glass with a thickness of 0.3mm;

[0061] The degree of vacuum of the vacuum press molding is 1×10 -2 Mpa, the pressing temperature is 80°C, and the pressing time is 1 min.

[0062] The temperature of the cooling annealing is 400° C., and the time is 30 minutes.

[0063] 3. Polishing and cleaning the surface of the prepared flat glass to clean the glass surface; then using a laser cutting machine to process the glass into the required shape to ...

Embodiment 2

[0066] A method for encapsulating glass-encapsulated devices, the encapsulation method comprising the following steps:

[0067] 1. Put the glass powder in the crucible, and then put the crucible with glass into the high-temperature furnace vacuum furnace to seal and vacuumize to ensure that the vacuum degree reaches 1×10 -2 Mpa, heated to 1300°C until the glass powder in the crucible melts to obtain a glass solution;

[0068] 2. Inject the glass solution into the mold for vacuum compression molding, then cool and anneal to obtain flat glass with a thickness of 0.5mm;

[0069] The degree of vacuum of the vacuum press molding is 1×10 -2 Mpa, the pressing temperature is 160°C, and the pressing time is 3 minutes.

[0070] The temperature of the cooling annealing is 480° C., and the time is 60 minutes.

[0071] 3. Polishing and cleaning the surface of the prepared flat glass to clean the glass surface; then using a laser cutting machine to process the glass into the required sha...

Embodiment 3

[0074] A method for encapsulating glass-encapsulated devices, the encapsulation method comprising the following steps:

[0075] 1. Put the glass powder in the crucible, and then put the crucible with glass into the high-temperature furnace vacuum furnace to seal and vacuumize to ensure that the vacuum degree reaches 1×10 -2 MPa, heated to 900°C until the glass powder in the crucible melts to obtain a glass solution;

[0076] 2. Inject the glass solution into the mold for vacuum compression molding, then cool and anneal to obtain flat glass with a thickness of 0.3mm;

[0077] The degree of vacuum of the vacuum press molding is 1×10 -2 Mpa, the pressing temperature is 100°C, and the pressing time is 2min.

[0078] The temperature of the cooling annealing is 420° C., and the time is 40 minutes.

[0079] 3. Polishing and cleaning the surface of the prepared flat glass to clean the glass surface; then using a laser cutting machine to process the glass into the required shape to ...

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Abstract

The invention provides a glass-containing packaging device and a packaging method and application thereof, and relates to the technical field of electronic component packaging. The packaging method comprises the following steps: firstly, melting glass powder to obtain a glass solution; injecting the glass solution into a mold, and carrying out vacuum compression molding to obtain plate glass; then cutting the plate glass to obtain a glass body A, wherein the glass solution does not contain a binder; and finally, assembling the metal shell, the glass body A and the internal accessories in a packaging shell mold, and sintering in a protective atmosphere to obtain the glass-containing packaging device. According to the packaging method, since the glass solution does not contain a binder, the prepared glass-containing packaging device is changed from opaque to transparent, the strength of the glass and the strength of the whole device are obviously improved, and the prepared packaging device can realize optical detection. The problems that glass is non-transparent and the glass strength is low when an existing traditional glass metal packaging technology is used for preparing a miniaturized electronic device are effectively solved.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic components, in particular to a glass-containing packaging device and a packaging method and application thereof. Background technique [0002] With the development of the economy and the progress of society, the development of science and technology has become an inevitable and social consensus. Various devices are developed in the direction of multi-functional integration, miniaturization, reliability, stability, environmental protection, and other characteristics. Packaging devices, used in aerospace, microwave communication, and electronic components. With the multi-functional integration, miniaturization, light weight, and device reliability of devices, it is becoming more and more difficult to meet the requirements. The glass thickness of the glass packaging part of traditional packaging devices is 1-6mm , The glass thickness of new devices requires a thickness of 0.3-0.5mm. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B11/00C03B25/00H01C17/02H01F41/00H01G13/00
CPCC03B11/005C03B25/00H01C17/02H01G13/00H01F41/00
Inventor 邹本辉宋兆龙
Owner 苏州融睿电子科技有限公司
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