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Porous copper foil and preparation method thereof

A technology of porous copper and electroplating copper, applied in the direction of electrolysis, electroforming, etc., can solve the problems of poor performance, high cost, complicated preparation process, etc., and achieve the effect of wide application space, low cost and simple process

Pending Publication Date: 2021-08-17
益阳市菲美特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing preparation methods of porous copper foil generally adopt weaving method or punching method, both of which cannot achieve ultra-thin thickness and better tensile strength, and the performance is not good. In addition, the existing preparation process is complex , high cost, needs further improvement

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The invention discloses a method for preparing ultra-thin porous copper foil with conductive cloth. The process route is as follows: the conductive cloth is subjected to copper electroplating, sintering and reduction, and roller rolling to prepare ultra-thin porous copper foil.

[0023] In this embodiment, the conductive fabric refers to a nickel-plated non-woven fabric with a thickness of 80 um and a weaving density of 300T.

[0024] In this embodiment, the copper electroplating refers to electroplating copper with conductive arrangement in the electroplating copper solution, and the copper surface density is 150g / m 2 . The copper electroplating solution is specifically a copper pyrophosphate solution, and its process parameters are: the concentration of copper pyrophosphate is 60g / L, the concentration of potassium pyrophosphate is 300g / L, the concentration of ammonium citrate is 30g / L, the concentration of ammonia water is 2ml / L, pH is 8.5, the temperature is 50°C, a...

Embodiment 2

[0029] The invention discloses a method for preparing ultra-thin porous copper foil with conductive cloth. The process route is as follows: the conductive cloth is subjected to copper electroplating, sintering and reduction, and roller rolling to prepare ultra-thin porous copper foil.

[0030] In this embodiment, the conductive cloth is a woven cloth plated with copper, its thickness is 50 um, and its weaving density is 250T.

[0031] In this embodiment, the copper electroplating refers to further electroplating copper on the conductive cloth, and the copper surface density is 80g / m 2 , The copper sulfate solution system is used in the copper electroplating process: the concentration of copper sulfate is 180g / L, the concentration of sulfuric acid is 30ml / L, the temperature is 25°C, and the current is 300A.

[0032] In this embodiment, the sintering reduction refers to placing the copper-plated material in an environment of 550° C. to incinerate the cloth, and then placing it i...

Embodiment 3

[0036] The invention discloses a method for preparing ultra-thin porous copper foil with conductive gauze. The process route is as follows: the conductive gauze is subjected to copper electroplating, sintering and reduction, and roller rolling to prepare ultra-thin porous copper foil.

[0037] In this embodiment, the conductive gauze refers to the gauze that has been plated with nickel, its thickness is 80um, and its aperture density is 300 mesh.

[0038] In this embodiment, the copper electroplating refers to electroplating copper by placing the conductive gauze in the copper electroplating solution, and the copper surface density is 200g / m 2 . The copper electroplating solution is specifically a copper pyrophosphate solution, and its process parameters are: the concentration of copper pyrophosphate is 60g / L, the concentration of potassium pyrophosphate is 300g / L, the concentration of ammonium citrate is 30g / L, the concentration of ammonia water is 2ml / L, pH is 8.8, the temp...

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Abstract

The invention provides a porous copper foil and a preparation method thereof. The thickness of the porous copper foil is 5-100 microns, the pore density is 30-1000 meshes, the pore structure is a longitude and latitude arrangement structure, and the tensile strength is 20-150 MPa. The invention further provides the preparation method for the porous copper foil. The preparation method comprises the step that a conductive base material is subjected to copper electroplating, sintering and reducing and calendering to obtain the ultrathin porous copper foil. Compared with a traditional copper foil, the porous copper foil has a larger specific surface area, the heat dissipation performance is greatly improved, the porous copper foil can quite well replace the traditional heat dissipation copper foil to be applied to mobile phones and other 3C intelligent products, and consumption of metal copper can be reduced; due to the porous structure, more volume space is released under the same volume, and then more fillers can be added, and the performance is improved; and because the porous copper foil is of the regular hole-shaped structure, the good effects of gas uniformizing, heat uniformizing and flow uniformizing can be achieved.

Description

technical field [0001] The invention relates to a porous copper foil and a preparation method thereof. Background technique [0002] The existing preparation methods of porous copper foil generally adopt weaving method or punching method, both of which cannot achieve ultra-thin thickness and better tensile strength, and the performance is not good. In addition, the existing preparation process is complex , The cost is high and needs to be further improved. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a porous copper foil and a preparation method thereof for the deficiencies of the prior art. [0004] The technical solution adopted by the present invention to solve its technical problems is: [0005] The porous copper foil of the present invention has a thickness of 5-100um, a hole density of 30-1000 mesh, a hole structure of warp and weft arrangement, and a tensile strength of 20-150MPa. [0006] The proces...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D1/08C25D1/20C25D3/38
CPCC25D1/04C25D1/08C25D3/38Y02E60/10
Inventor 吴中和吴庆锋刘秀苗
Owner 益阳市菲美特新材料有限公司
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