Active heat dissipation structure of flip-chip bonding device and interconnection method

Abstract

The invention relates to an active heat dissipation structure of a flip-chip bonding device and an interconnection method. The active heat dissipation structure comprises a packaging substrate, a flip chip, an electric interconnection material, an electric interconnection material, bottom filling glue, a heat dissipation sheet and a heat dissipation device, wherein the electric interconnection material is arranged on the front surface of the flip chip, the flip chip is inversely arranged on the packaging substrate and is bonded and fixed through the bottom filling glue, the central area of the bottom of the heat dissipation device is connected with the flip chip through the heat dissipation sheet, the periphery of the flip chip is connected with the packaging substrate through the electric interconnection material and fixed through the bottom filling glue, an active heat dissipation mode is adopted in the interconnection method, additional auxiliary heat dissipation is not needed, the heat dissipation efficiency is high, the working temperature environment of the chip can be optimized, and the service life of the chip is prolonged.

Description

technical field [0001] The invention relates to an active heat dissipation structure and an interconnection method of flip-chip soldering devices, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of VLSIs such as FPGA, SoC, CPU, and DSP towards high speed, high density, and high performance, the continuous improvement of device power consumption makes thermal management a key technical link in the packaging process. At present, common high-performance integrated circuits adopt a non-airtight flip-chip packaging structure. The chip is flip-chip interconnected with the packaging substrate through solder bumps, and then the heat sink is bonded to the back of the chip with heat-conducting adhesive. The heat generated by the chip passes through the back of the chip- Thermal Paste - The path of the heat sink conducts to the environment and improves the thermal performance of the circuit by increasing the heat sink area...

AI Technical Summary

Problems solved by technology

[0008] The technical problem solved by the invention is: Aiming at the problems in the current prior art that the heat dissipation efficiency of the passive heat sink is low, which hinders the heat conduction of the chip and causes a higher junction temperature and thus affects the performance of the chip, an active flip-chip soldering device is proposed. Heat dissipation structure and interconnection method

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