A kind of preparation method of alumina ceramic material and alumina ceramic substrate

A technology of alumina ceramics and alumina powder, applied in the field of ceramic materials, can solve the problems of low thermal conductivity and fracture toughness, increase of substrate firing temperature, increase of thermal expansion coefficient, etc., achieve high density, reduce sintering temperature, increase Effect of Thermal Shock Resistance

Active Publication Date: 2022-04-22
HUNAN UNIV
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Problems solved by technology

Compared with other materials, Al 2 o 3 It has the advantages of abundant raw material sources, low price, high strength, high hardness, high dimensional accuracy, and good adhesion to metals, and is widely used in the electronics industry, but its low thermal conductivity and fracture toughness also limit its further application.
By increasing Al in the substrate 2 o 3 The content of will increase its fracture toughness and thermal conductivity, but the effect is not obvious, and it will also lead to an increase in the firing temperature of the substrate and an increase in production costs
[0003] It has been reported in the literature that by adding 3Y-ZrO 2 to significantly increase the Al 2 o 3 Fracture toughness of ceramics (such as Chinese patent application CN202010972402.3; Sui Yudong, Research progress in the preparation process of zirconia toughened alumina composite ceramics Science and technology innovation and application, 2020, issue 13; Zeng Feng, Fang Hailiang, Wang Lianjun, Jiang Wan. Oxidation Research on the properties of zirconium toughened alumina ceramics, Guangdong Chemical Industry, 2018, Issue 4, etc.), but it will also lead to an increase in the sintering temperature of the ceramics, and an increase in the thermal expansion coefficient; there is also a report in the Chinese patent application CN202011132985. 2 to increase Al 2 o 3 The fracture toughness and thermal conductivity of ceramics, but the patent application did not provide specific data, and the effect is unknown
In addition, there are also patent reports that the Al 2 o 3 There are many reports on the fracture toughness of ceramics (such as CN201910448036.9, CN201811608753.5), which have achieved remarkable results, but the above materials all need to be sintered in an inert atmosphere or vacuum, which significantly increases the production cost
Moreover, there are few reports on the use of SiC addition to improve the thermal conductivity of alumina ceramics.

Method used

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  • A kind of preparation method of alumina ceramic material and alumina ceramic substrate
  • A kind of preparation method of alumina ceramic material and alumina ceramic substrate
  • A kind of preparation method of alumina ceramic material and alumina ceramic substrate

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Experimental program
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Effect test

Embodiment 1

[0062] The preparation method of the alumina ceramic substrate of the present embodiment is as follows:

[0063] (1) will D 50 2.5μm silicon carbide powder (μm-SiC), 1.0μm alumina powder (μm-Al 2 o 3 ), 50nm alumina powder (nm-Al 2 o 3 ) powder, and 1.0μm sintering aid powder TiO 2 All were dried at 80°C for 24 hours, and then pressed as μm-SiC powder 4%, μm-Al2 o 3 Powder 89.8%, nm-Al 2 o 3 Powder 5%, sintering aid powder TiO 2 1.2% (mass percentage) was weighed separately for subsequent use;

[0064] (2) The weighed μm-SiC and μm-Al 2 o 3 Put the powder into the ball mill, use water as the medium, and the corundum ball as the grinding ball (the mass ratio of powder: grinding ball: water is 1:2:1.5), first ball mill for 4 hours, and the speed of the ball mill is 300 rpm. -1 , and then add powder (μm-SiC and μm-Al 2 o 3 ) quality 10% PVA solution (concentration of PVA is 4wt%), ball milling 0.5h again, ball mill speed is 200 rev min -1 ;

[0065] (3) Spray gran...

Embodiment 2

[0069] The preparation method of the alumina ceramic substrate of the present embodiment is as follows:

[0070] (1) will D 50 2.5μm silicon carbide powder (μm-SiC), 1.0μm alumina powder (μm-Al 2 o 3 ), 50nm alumina powder (nm-Al 2 o 3 ) powder, and 1.0μm sintering aid powder (made of MgO, TiO 2 According to the mass ratio of 2:3), all were dried at 80°C for 24h, and then 8% of μm-SiC powder, μm-Al 2 o 3 Powder 81%, nm-Al 2 o 3 10% of the powder and 1% (mass fraction) of the sintering aid powder are weighed separately for later use;

[0071] (2) The weighed μm-SiC and μm-Al 2 o 3 Put it into a ball mill, use water as the medium, and corundum balls as grinding balls (the mass ratio of powder: grinding balls: water is 1:2:1.5), first ball mill for 6 hours, and the speed of the ball mill is 400 rpm. -1 , and then add powder mass (μm-SiC and μm-Al 2 o 3 quality) 10% PVA solution, then ball milled for 0.5h, and the ball mill speed was 200 rpm. -1 ;

[0072] (3) Spray...

Embodiment 3

[0076] The preparation method of the alumina ceramic substrate of the present embodiment is as follows:

[0077] (1) will D 50 2.5μm silicon carbide powder (μm-SiC), 1.0μm alumina powder (μm-Al 2 o 3 ), 50nm alumina powder (nm-Al 2 o 3 ) powder, and 1.0 μm sintering aid powder (composed of MgO, CaO in a mass ratio of 5:3) were dried at 80°C for 24 hours, and then pressed as μm-SiC powder 12%, μm-Al 2 o 3 Powder 71.4%, nm-Al 2 o 3 15% of the powder and 1.6% (mass percentage) of the sintering aid powder are weighed separately for later use;

[0078] (2) The weighed μm-SiC and μm-Al 2 o 3 Put the powder into the ball mill, use water as the medium, and the corundum ball as the grinding ball (the mass ratio of powder: grinding ball: water is 1:2:1.5), first ball mill for 8 hours, and the speed of the ball mill is 450 rpm. -1 , and then add the powder mass (μm-SiC and μm-Al 2 o 3 total mass) of 10% PVA solution, then ball milled for 0.5h, and the ball mill speed was 200 ...

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Abstract

The present invention relates to a preparation method of alumina ceramic material and alumina ceramic substrate, mixing micron-sized silicon carbide powder and micron-sized alumina powder according to the mass ratio of 0.1-50:30-90, and ball milling to obtain slurry A , granulation to obtain powder A, after calcining, powder B is obtained; powder B is mixed with nano-scale alumina powder and sintering aid, ball milled to obtain slurry B, after granulation, pressed to obtain a green body; After the green body is dried, it is sintered to obtain an alumina ceramic material. The present invention improves Al by adding SiC 2 o 3 The thermal conductivity, strength and fracture toughness of the substrate have improved the thermal shock resistance of the substrate; the Al 2 o 3 Substrate; through Al 2 o 3 Grading of raw material powder, addition of sintering aids, and SiO formed by micro-oxidation on the surface of SiC particles 2 , The synergistic effect of the three reduces the sintering temperature. The process of the invention is simple and stable, the product performance is excellent, the cost is low, and the invention is suitable for popularization.

Description

technical field [0001] The invention relates to a preparation method of an alumina ceramic material and an alumina ceramic substrate, belonging to the field of ceramic materials. Background technique [0002] The substrate for electronic packaging is a base electronic component that provides mechanical load and support, airtight protection, and promotes heat dissipation for electronic components and their interconnections. Ceramic substrates are widely used in product packaging in aviation, aerospace and military engineering because of their advantages such as high strength, good insulation performance, small dielectric constant, good high-frequency characteristics, small thermal expansion coefficient, and high thermal conductivity. The currently developed ceramic substrate materials mainly include Al 2 o 3 , SiC, AlN, Si 3 N 4 and BeO et al. Compared with other materials, Al 2 o 3 It has the advantages of abundant raw material sources, low price, high strength, high ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/10C04B35/64
CPCC04B35/10C04B35/64C04B2235/3826C04B2235/3208C04B2235/3206C04B2235/3232C04B2235/3241C04B2235/6562C04B2235/6567C04B2235/96C04B2235/9607
Inventor 高朋召刘小磐郑航博王垣力
Owner HUNAN UNIV
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