Bidirectional switch power module and preparation method thereof

A technology of power modules and bidirectional switches, applied in the direction of output power conversion devices, electrical components, high-efficiency power electronics conversion, etc., can solve the problems that do not conform to the development trend of modularization and integration, low power density, and low integration , to achieve the effect of good thermal cycle, high density and high integration

Pending Publication Date: 2021-07-09
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the current matrix converter circuit is often built with discrete devices, with low integration, large volume, and low power density, and does not conform to the current development trend of modularization and integration in the direction of power electronics.

Method used

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  • Bidirectional switch power module and preparation method thereof
  • Bidirectional switch power module and preparation method thereof
  • Bidirectional switch power module and preparation method thereof

Examples

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Embodiment Construction

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0043] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediar...

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Abstract

The invention discloses a bidirectional switch power module and a preparation method thereof, one side surface of a copper-clad substrate DBC is sequentially provided with a driving terminal, silicon carbide MOSFET chips and a power terminal, a plurality of silicon carbide MOSFET chips are arranged at intervals, the plurality of silicon carbide MOSFET chips are connected in parallel in pairs to form two power electronic switches in different directions, the grid electrode and the source electrode of each silicon carbide MOSFET chip are respectively connected with the driving terminal through a driving resistor, the plurality of silicon carbide MOSFET chips are arranged on the same copper substrate, and the source electrodes are respectively connected with the power terminal to form common drain electrode connection. According to the invention, the working frequency is higher, the reliability is better, the thermal resistance is lower, and the electrical performance is good.

Description

technical field [0001] The invention belongs to the technical field of power device packaging, and in particular relates to a bidirectional switch power module and a preparation method thereof. Background technique [0002] As a third-generation semiconductor material, silicon carbide has excellent properties such as three times the band gap and thermal conductivity of silicon, and ten times the breakdown field strength of silicon. Therefore, it has higher voltage blocking capability, lower on-state voltage drop, higher switching speed, higher operating temperature and lower thermal resistance. Therefore, compared with silicon power devices, silicon carbide power devices have smaller conduction and switching losses, and have a higher operating temperature. Bidirectional switching power modules based on silicon carbide MOSFETs can have higher operating temperatures, higher packaging integration and higher reliability. [0003] A bidirectional switch, capable of controlling ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/31H01L25/07H01L29/16H01L29/78H02M1/00
CPCH01L23/142H01L23/3107H01L25/072H01L29/78H01L29/1608H02M1/00Y02B70/10H01L2224/0603H01L2224/49111H01L2224/48227
Inventor 王来利孙立杰侯震鹏赵成裴云庆杨旭甘永梅张虹
Owner XI AN JIAOTONG UNIV
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