Loop heat pipe with multi-scale structure synergistic mixed wettability inner surface

Abstract

The invention discloses a loop heat pipe with a multi-scale structure synergistic mixed wettability inner surface. All parts are sequentially connected in series to form a cycle, the interior of the loop heat pipe is provided with the multi-scale structure synergistic mixed wettability inner surface, and the loop heat pipe comprises an evaporator, a condenser, a steam line and a liquid line, and the evaporator is provided with a multi-scale capillary core with gradient hydrophilicity and hydrophobicity. The size is gradually reduced in the circulation direction, the surface is transited from hydrophobicity to hydrophilicity, hydrophobic points are arranged in a hydrophilic area, and hydrophilic points are arranged in a hydrophobic area. The condenser is provided with a multi-scale micro-column inner surface with gradient hydrophobicity, the surface of a nanoneedle transits from super hydrophobicity to hydrophobicity in the circulation direction, and the top end of the embedded micro-column is hydrophilic and forms a hydrophilic point. The steam line and the liquid line are reducing pipes, the pipe diameter and the size of the porous structure on the inner surface are gradually reduced in the circulation direction, and gradient wettability is achieved. By means of the reasonably-designed cooperation mode of the surface multi-scale structure and the mixed wettability, the requirements of different areas and stages of the loop heat pipe for the structure scale and wettability can be met, and the heat exchange performance of the loop heat pipe is improved through all-around cooperation.

Description

technical field [0001] The invention relates to a loop heat pipe with a multi-scale structure synergistically mixed and wetted inner surface, which belongs to the field of ultra-high heat flux thermal management. Background technique [0002] The high power and integration of electronic devices make them have the characteristics of high heat flux density and small space scale. Electronic devices emit a lot of heat during their working process. If the temperature is not controlled by the thermal management device, it will lead to problems such as reduced reliability, shortened lifespan, and even overheating damage due to excessive temperature. How to achieve high heat flux thermal management in a confined space has become a bottleneck restricting the development of electronic devices. The operating environment of electronic devices is complex, which puts forward high requirements for the reliability and adaptability of thermal management technology. [0003] The loop heat p...

AI Technical Summary

Problems solved by technology

[0005] Traditional loop heat pipe structure optimization mostly only focuses on the increase of the capillary force of the evaporator, but ignores the increase of the capillary force of other components, the promotion of the boiling heat transfer of the working medium in the evaporator, and the enhancement of condensation in the condenser, etc., and the optimization effect is limited.

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