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Liquid cooling heat dissipation device and heat dissipation circulation system

A liquid cooling heat dissipation and heat dissipation medium technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of poor cooling effect, low cooling power, and poor circulation of heat dissipation medium, so as to reduce resistance and improve heat reception Ability to avoid the effect of too much kinetic energy falling too fast

Active Publication Date: 2022-07-22
ZHEJIANG DAHUA TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention provides a liquid-cooled heat dissipation device to solve the problems of low cooling power, poor cooling effect, and poor flow and circulation of heat dissipation medium that occur when traditional liquid-cooled heat dissipation plates are used to cool equipment.

Method used

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  • Liquid cooling heat dissipation device and heat dissipation circulation system
  • Liquid cooling heat dissipation device and heat dissipation circulation system
  • Liquid cooling heat dissipation device and heat dissipation circulation system

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Embodiment Construction

[0069] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "or / and" includes any and all combina...

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Abstract

The invention provides a liquid cooling heat dissipation device and a heat dissipation circulation system, and the device comprises a heated part which comprises a heated area used for receiving heat generated by a to-be-cooled part; the medium flow channel allows a heat dissipation medium to flow therein, can be communicated with an external heat removal space and is provided with a flowing surface which is in heat conduction connection with the heated area; the liquid cooling heat dissipation device is further provided with an internal heat dissipation space communicated with the medium flow channel, and the flow surface is provided with a fluctuating structure used for disturbing and dividing the heat dissipation medium into a plurality of flow branches, so that the flow branches can flow to the external heat dissipation space and the internal heat dissipation space respectively.

Description

technical field [0001] The invention relates to the technical field of refrigeration temperature control, in particular to a liquid-cooled heat dissipation device and a heat dissipation circulation system. Background technique [0002] With the investment of information and intelligent infrastructure, more and more big data computing and storage centers, servers, and communication base stations are being used. To ensure stable operation of these devices for a long time, it is necessary to add a reliable and efficient cooling system. . [0003] At present, the mainstream cooling systems used in the above equipment mostly adopt the liquid cooling mode, which has better heat dissipation capacity, lower noise, lower power consumption and higher adaptability to diverse environments than air-cooled liquid-cooled heat dissipation. . The liquid-cooled heat-dissipating plate used in the cooling system is provided with a liquid flow channel for the cooling medium to flow through. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20327H05K7/208
Inventor 张孟臣张超
Owner ZHEJIANG DAHUA TECH CO LTD
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