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Silicon carbide nano heat-insulating and wave-absorbing composite material and preparation method thereof

A silicon carbide nanowire and nano thermal insulation technology, which is applied in the fields of carbon compounds, chemical instruments and methods, carbon preparation/purification, etc. , failure to achieve the expected goals, etc.

Active Publication Date: 2021-06-29
NORTHWESTERN POLYTECHNICAL UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this invention is a one-dimensional nano-wave absorbing material, which does not have the structural advantages of a three-dimensional space network
[0009] As shown in the above-mentioned patents, in order to realize the preparation of high-temperature-resistant heat-insulating and wave-absorbing materials, silicon carbide materials are generally used as the main material for design, but it is difficult to effectively balance heat-insulating and wave-absorbing performances during the preparation process, and at the same time, the space structure The design is relatively simple and cannot achieve the expected goal

Method used

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  • Silicon carbide nano heat-insulating and wave-absorbing composite material and preparation method thereof

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Embodiment 1

[0024] refer to figure 1 , is a schematic diagram of the structure of a silicon carbide nano heat-insulating and wave-absorbing composite material, 10 is the carbon foam substrate template, 20 is the SiC coating reinforced interface, 30 is the initial SiC nanowire, 40 is the secondary SiC nanowire, the volume The density is 20.0kg / m 3 , the thermal conductivity at room temperature is 0.032W / (m K), the minimum reflection loss is -38.0dB, the carbon foam base template is a three-dimensional open-pore structure, the compression modulus is 250.0kPa, and the absorption capacity is 7.8kJ / m 3 , the porosity is 96.0%, the cell size is 30.0μm; the silicon carbide coating reinforced interface is discontinuously distributed on the surface of the carbon foam substrate skeleton, the thickness is 1.5μm, the compressive strength is 1.2Mpa, and the compression modulus is 12.0MPa ; The SiC nanowire network structure grows in a dendritic bifurcation at the SiC coating reinforcement interface, ...

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Abstract

The invention discloses a silicon carbide nano heat-insulating and wave-absorbing composite material and a preparation method thereof. The silicon carbide nano heat-insulating and wave-absorbing composite material is composed of a carbon foam substrate template, a silicon carbide coating enhanced interface and a silicon carbide nanowire network structure. Carbon foam which is not completely decomposed is adopted as the substrate template, the silicon carbide coating enhanced interface with the surface discontinuously and interruptedly distributed is formed, initial silicon carbide nanowires are prepared by adopting the technology of firstly introducing gas and then achieving heating in a chemical vapor infiltration process, a T-shaped pinning structure is formed with the silicon carbide coating enhanced interface, then a residual catalyst is removed by adopting high-temperature oxidation and high-speed carrier gas flow, a T-shaped pinning structure is formed by prepared secondary silicon carbide nanowires and the initial silicon carbide nanowires, the silicon carbide nanowire network structure is formed through mutual interweaving, continuous fusion of the silicon carbide coating enhanced interface and penetration of the silicon carbide nanowires through foam holes are avoided, the heat transmission path is effectively prolonged, meanwhile, reflection and absorption of electromagnetic waves are promoted, and the heat insulation performance is cooperatively improved.

Description

technical field [0001] The patent of the present invention relates to a heat-insulating and wave-absorbing composite material, in particular to a silicon carbide nano-heat-insulating and wave-absorbing composite material, which can realize long-term application under high-temperature and complex service conditions. [0002] technical background [0003] With the development and application of electromagnetic technology, various electronic and electrical products are widely used in various fields of social life. When electronic equipment is running, it will generate strong electromagnetic radiation to the surrounding environment to achieve signal transmission, but it will inevitably affect the ecological environment. The environment and human beings produce serious electromagnetic pollution, and equipment signals interact with each other to form a complex electromagnetic network, which not only interferes with the normal operation of electronic systems, but also aggravates the ...

Claims

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Application Information

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IPC IPC(8): C23C16/02C23C16/04C23C16/32B82Y30/00B82Y40/00C01B32/05C01B32/977
CPCC23C16/02C23C16/045C23C16/325C01B32/05C01B32/977B82Y40/00B82Y30/00
Inventor 叶信立
Owner NORTHWESTERN POLYTECHNICAL UNIV
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