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Copper surface cleaning agent and use method thereof

A cleaning agent and copper surface technology, which is applied in the field of copper surface cleaning agent, can solve problems such as unevenness and coarsening decline, and achieve the effects of improving coarsening decline or unevenness, improving product yield, and good cleaning effect

Pending Publication Date: 2021-06-18
珠海市板明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to effectively remove impurities such as oxides, dust, grease, and fingerprints on the copper surface, and improve the problem of reduced or uneven coarsening of the copper surface after roughening and micro-etching

Method used

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  • Copper surface cleaning agent and use method thereof
  • Copper surface cleaning agent and use method thereof
  • Copper surface cleaning agent and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A copper surface cleaning agent is made up of acid, hydrogen peroxide, hydrogen peroxide stabilizer, cationic surfactant, nonionic surfactant and water, the concentration of the acid is 90g / L, and the concentration of the hydrogen peroxide is 36g / L, The concentration of the hydrogen peroxide stabilizer is 5g / L, the concentration of the cationic surfactant is 5g / L, and the concentration of the nonionic surfactant is 10g / L.

[0039] The acid is sulfuric acid. The hydrogen peroxide stabilizer is sodium p-hydroxybenzenesulfonate. The cationic surfactant is polyethyleneimine polymer. The nonionic surfactant is isooctyl alcohol polyoxyethylene ether.

[0040] The method for using the copper surface cleaning agent in this embodiment is to use the above-mentioned copper surface cleaning agent to perform microetching cleaning on the copper surface at 30° C., the cleaning time is 60 s, and the microetching amount is 0.3 μm. The microetching cleaning method is soaking.

Embodiment 2

[0042] A copper surface cleaning agent is made up of acid, hydrogen peroxide, hydrogen peroxide stabilizer, cationic surfactant, nonionic surfactant and water, the concentration of the acid is 20g / L, and the concentration of the hydrogen peroxide is 75g / L, The concentration of the hydrogen peroxide stabilizer is 10g / L, the concentration of the cationic surfactant is 0.01g / L, and the concentration of the nonionic surfactant is 10g / L.

[0043] The acid is sulfuric acid. The hydrogen peroxide stabilizer is sodium p-hydroxybenzenesulfonate. The cationic surfactant is a polyallylamine cationic surfactant. The nonionic surfactant is isooctyl alcohol polyoxyethylene ether.

[0044] The method for using the copper surface cleaning agent in this embodiment is to use the above-mentioned copper surface cleaning agent to perform microetching cleaning on the copper surface at 30° C., the cleaning time is 60 s, and the microetching amount is 0.3 μm. The microetching cleaning method is so...

Embodiment 3

[0046] A copper surface cleaning agent is made up of acid, hydrogen peroxide, hydrogen peroxide stabilizer, cationic surfactant, nonionic surfactant and water, the concentration of the acid is 160g / L, and the concentration of the hydrogen peroxide is 1g / L, The concentration of the hydrogen peroxide stabilizer is 0.01g / L, the concentration of the cationic surfactant is 5g / L, and the concentration of the nonionic surfactant is 0.01g / L.

[0047] The acid consisted of 140 g / L sulfuric acid and 20 g / L citric acid. The hydrogen peroxide stabilizer is sodium p-hydroxybenzenesulfonate. The cationic surfactant is polyethyleneimine polymer. The nonionic surfactant is isooctyl alcohol polyoxyethylene ether.

[0048] The method for using the copper surface cleaning agent in this embodiment is to use the above-mentioned copper surface cleaning agent to perform microetching cleaning on the copper surface at 30° C., the cleaning time is 60 s, and the microetching amount is 0.3 μm. The mic...

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Abstract

The invention provides a copper surface cleaning agent and a using method thereof. The copper surface cleaning agent is composed of acid, hydrogen peroxide, a hydrogen peroxide stabilizer, a cationic surface active agent, a nonionic surface active agent and water. The concentration of the acid is 20 g / L-160 g / L, the concentration of the hydrogen peroxide is 1 g / L-75 g / L, the concentration of the hydrogen peroxide stabilizer is 0.02 g / L-10 g / L, the concentration of the cationic surface active agent is 0.01 g / L to 10 g / L, and the concentration of the nonionic surface active agent is 0.01 g / L to 20 g / L. The cleaning agent has a good cleaning effect on oxides, dust, grease, fingerprints and other impurities on the copper surface under the condition of the low micro-etching amount, the problem that coarsening is reduced or uneven after coarsening and micro-etching of the copper surface can be solved, and the yield of finished products can be better increased.

Description

technical field [0001] The invention relates to the technical field of copper surface cleaning, in particular to a copper surface cleaning agent and a using method thereof. Background technique [0002] The development of high-density interconnection / build-up multilayer (HDI / BUM) and IC packaging substrates has shown a good momentum. The interlayer interconnection of IC substrates and the manufacturing method of laminated fine circuits are derived from HDI / BUM. The forming process of HDI / BUM board can be divided into subtractive method and additive method. In the subtractive method, a photoresist (photoresist) is pasted on the copper-clad board, and the required circuit pattern is formed after exposure and development, and then the copper in the non-circuit area is removed by chemical etching potion, and then the pattern is formed by stripping the film. circuit. In the full additive method, copper is plated up from the bare dielectric substrate to build the circuit in the...

Claims

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Application Information

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IPC IPC(8): C23G1/10
CPCC23G1/103
Inventor 陈修宁郝意黄志齐
Owner 珠海市板明科技有限公司
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