Circuit board, circuit board via optimization method, electronic device and storage medium

Abstract

The present application provides a circuit board and a circuit board via optimization method, the circuit board comprising: a first circuit layer and a second circuit layer; a first dielectric layer arranged between the first circuit layer and the second circuit layer; The via hole runs through the first dielectric layer and electrically connects the first circuit layer and the second circuit layer, and a first anti-pad is provided around the via hole near the end of the first circuit layer; the second dielectric layer is provided on the second circuit layer. A circuit layer is away from the side of the second circuit layer; the first ground layer is arranged on the side of the second dielectric layer away from the first circuit layer, and a first opening is formed in the area of ​​the first ground layer corresponding to the first anti-pad . This application can avoid the formation of parasitic capacitance between the ground layer and the via hole by opening an opening in the area corresponding to the anti-pad on the ground layer, thereby improving the problem of discontinuous impedance of the multi-layer PCB via hole to a certain extent, and at the same time ensuring the strength of the PCB. Reduce manufacturing costs, and do not take up too much PCB layout space.

Description

technical field [0001] The present application relates to the field of printed circuit boards, in particular, to a circuit board and a method for optimizing circuit board vias. Background technique [0002] At present, electronic devices such as mobile phones and notebooks, communication modules, and electronic components such as memory sticks usually use a multilayer PCB (Printed Circuit Board, printed circuit board). In a multi-layer PCB, in order to achieve signal communication between different layers, vias are usually provided. In the high-frequency field, via stubs will cause via impedance discontinuity, or lead to parasitic capacitance or resistance, which will seriously affect the transmission of high-speed signals, cause signal integrity problems, and also cause reflections on the radio frequency link question. [0003] With the improvement of communication bandwidth and data transmission rate in the 5G era, the radio frequency has been increased to the millimeter...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiments of the present application is to provide a circuit board via hole optimization method and a circuit board to improve the problem of discontinuous impedance of multi-layer PCB via holes in the prior art, and at the same time, ensure the strength of the PCB without increasing the PCB manufacturing process , reduces manufacturing cost, and does not take up too much PCB layout space

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