Lunar dust protection conductive film with micro-nano structure and preparation method thereof
A technology of micro-nano structure and conductive film, applied to the conductive layer on the insulating carrier, equipment for manufacturing conductive/semiconductive layer, cable/conductor manufacturing, etc., to achieve good moon dust protection effect, good conductive properties, good Effects of Lunar Environmental Adaptability
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Embodiment 1-5
[0034] Embodiment 1-5: Secondary nano conductive filling layer 3 solvent ratio
[0035] The aluminum metal substrate was ultrasonically cleaned with ethanol and ultrapure water for 15 minutes in turn for surface polishing treatment, and then placed in a plasma treatment box for plasma treatment (power 200w, time 30s), and the surface polishing treatment of aluminum Coat a layer of 3M 2216 B / A gray glue on the metal substrate, then spin-coat ITO aqueous solution (5000r / min, 10s), then place it in an oven to dry for 30min (70°C), take it out and perform compression molding, and then put it in the oven to dry 4h (70°C). On the surface of the primary micron structure layer 2, evenly spray the graphene sheet solution with a mass fraction of 3%, 4%, 5%, 6% and 7%, spray for 10s, then place it in an oven at 70°C for 0.5h, and take it out Afterwards, evenly wipe off the graphene sheet solution that is not closely adhered to the surface to form a secondary nanometer conductive filling...
Embodiment 6-10
[0039] Embodiment 6-10: Secondary nano conductive filling layer 3 solvent ratio
[0040] Complete the preparation of the first-level micron structure of the film according to the method steps listed in Examples 1-5. The second-level nano-conductive filling layer 3 is sprayed with carbon nanotube solutions with different mass fractions, sprayed for 10 seconds, and then placed in an oven at 70 ° C. Bake for 0.5h, take it out and evenly wipe off the carbon nanotube solution that is not tightly bonded on the surface to form a secondary nano-conductive filling layer 3. The contact angle of the protective film and the decrease in the adhesion of moon dust measured through experiments are shown in Table 2. .
[0041] Table 2 Performance comparison under different carbon nanotube concentrations
[0042]
[0043] The study found that the mass percentage of the carbon nanotube solution directly affects the contact angle of the protective conductive film and the adhesion force with t...
Embodiment 11-13
[0044] Examples 11-13: Secondary nanometer conductive filling layer 3 solvent ratio
[0045] Complete the preparation of the first-level micron structure of the film according to the method steps listed in Examples 6-9. The second-level nano-conductive filling layer 3 is sprayed with white carbon black solutions with different mass fractions, sprayed for 10 seconds, and then placed in an oven at 70 ° C. Bake for 0.5h, take it out and evenly wipe off the silica solution that is not tightly bonded on the surface to form a second-level nano-conductive filling layer 3. The contact angle of the protective film and the decrease in the adhesion of moon dust measured through experiments are shown in Table 3. .
[0046] Table 3 Performance comparison under different silica concentrations
[0047]
[0048] The study found that the mass percentage of silica solution directly affects the contact angle of the protective conductive film and the adhesion between the protective conductive...
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