A kind of nano-wafer product nitrogen protection cleaning method

Abstract

The invention discloses a nitrogen protection and cleaning method for nano-wafer products, comprising the following steps: Step 1. Move a liquid cleaning nozzle, an atomizing cleaning nozzle and a nitrogen nozzle to the top of the wafer, and adjust the atomizing cleaning nozzle and the crystal The distance between the wafers is 14-30 mm; in step 2, the wafer carrier mechanism drives the wafer to rotate, the external air source of the nitrogen nozzle supplies air, blows nitrogen to the surface of the wafer, and turns on the liquid cleaning nozzle and mist in turn. The cleaning nozzle sprays the cleaning liquid on the surface of the wafer to clean the surface of the wafer; Step 3: After the cleaning is completed, the atomizing cleaning nozzle, the liquid cleaning nozzle and the nitrogen nozzle are closed in turn, and the positive Move up. The invention adopts nitrogen blowing to form a gas protective film on the surface of the mist water, maintain the surface energy of the liquid, prevent the agglomeration of droplet molecules, and ensure the cleaning effect of the nano-wafer.

Description

technical field [0001] The invention belongs to the technical field of semiconductor cleaning equipment, and particularly relates to a nitrogen protection cleaning method for nano-wafer products. Background technique [0002] In the field of semiconductor cleaning, for high-end wafer products, such as related wafer products involving logic integrated circuits, storage, power devices and other products, in the manufacturing process, through various complex lithography, wet method, deposition, However, after each stage of the process, it needs to be processed by a cleaning process to ensure the accuracy and reproducibility of the subsequent process. [0003] Especially for the wafer cleaning wet process that requires 65-14nm pitch, and the wafer products whose size is below 14nm and extends to 5nm pitch, under the effect of the size effect, the core problem of the wafer wet process is that the liquid remains in the nanometer. in the microstructure of the wafer. Storage produ...

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Problems solved by technology

Storage products such as DRAM NAND and other related structures have different metallization microstructures and high aspect ratio pattern distribution. If the general cleaning method is used, the surface of the nanowafer cannot be cleaned well due to the accumulation of liquid particles. Cleaning is a problem that needs to be solved urgently

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