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Protective liquid film composition for laser-induced supercritical liquid ablation processing, and laser cutting process

A laser-induced, supercritical technology, applied in semiconductor/solid-state device manufacturing, coating, electrical components, etc., can solve the problem that the protective film has no obvious improvement effect

Active Publication Date: 2021-05-25
科纳瑞雅(昆山)新材料科技有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

Although the solid film avoids the problem of thermal decomposition of the film by enhancing the heat resistance, it also isolates the nano-scale dust particles produced after the material is fully vaporized and condensed. It will still stay inside the slit, resulting in cross-section melting and slag on the surface of the slit inside the slit. For these problems, this type of protective film has no obvious improvement effect

Method used

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  • Protective liquid film composition for laser-induced supercritical liquid ablation processing, and laser cutting process
  • Protective liquid film composition for laser-induced supercritical liquid ablation processing, and laser cutting process
  • Protective liquid film composition for laser-induced supercritical liquid ablation processing, and laser cutting process

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Embodiment Construction

[0032] In order to be able to understand the technical means of the present invention more clearly and implement it according to the contents of the description, the specific implementation of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.

[0033] According to the formula composition of each specific embodiment and comparative example recorded in the following table 1, the matrix mixture, coolant, wetting agent, and defoamer capable of laser-induced generation of supercritical liquid are dropped into a mixing device provided with a stirrer After mixing with water, stir at room temperature at a speed of 500 rpm for 1 hour to manufacture a wafer protective film or protective liquid film composition for laser dicing.

[0034] Table 1 specific embodiment and comparative example compos...

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Abstract

The invention discloses a protective liquid film composition for laser-induced supercritical liquid ablation processing, and a laser cutting process, belonging to the technical field of chemical reagents for semiconductor processing and processing processes. The composition mainly comprises a matrix mixture capable of generating supercritical liquid through laser induction, a coolant, a wetting agent, a defoaming agent and water. During use, the protective liquid film composition is spin-coated on a processed surface of a material, and laser permeates a liquid film, then irradiates the material surface and induces the composition to generate the supercritical liquid which can effectively remove chippings generated by laser ablation, melts accumulated around an action area and a crater height.

Description

technical field [0001] The invention relates to a laser protective film composition and a laser cutting process, in particular to a protective liquid film composition for laser-induced supercritical liquid ablation processing and a semiconductor laser cutting process using the composition, belonging to the semiconductor The technical field of chemical reagents for processing and processing technology. Background technique [0002] In the manufacturing process of semiconductor wafers, since the grain size decreases with the increase of chip integration, the interval of dicing lines needs to be gradually narrowed accordingly. The dicing process in the back-end packaging process for such products has been changed from Traditional knife wheel cutting is gradually turning to laser cutting. In the wafer cutting process using a laser, the laser energy is absorbed by the substrate to absorb heat energy, causing dust or slag generated by silicon melting or gasification to condense a...

Claims

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Application Information

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IPC IPC(8): C09D171/02C09D139/06C09D7/63H01L21/78
CPCC09D171/02C09D139/06C09D7/63H01L21/78C08L2203/20C08L71/02C08K5/053C08K5/41C08K5/06Y02P20/54
Inventor 陈宇
Owner 科纳瑞雅(昆山)新材料科技有限公司
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