Foil plating device for producing copper foil adhesive tape
A technology of tape and copper foil, which is applied to devices for coating liquid on the surface, adhesives, film/sheet-like adhesives, etc.
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[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] see Figure 1-5 , an embodiment provided by the present invention: a foil plating device for the production of copper foil tape, including a foil coater body 1 and a motor 2, a motor 2 is installed on the top of the foil coater body 1, and the output of the motor 2 The end is fixedly connected with a connecting shaft 3, and the end of the connecting shaft 3 away from the motor 2 is fixedly connected with a first bevel gear 4, and the surface of the firs...
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