Preparation method of semiconductor device

Abstract

The invention provides a preparation method of a semiconductor device, and relates to the technical field of a semiconductor preparation process, and the method comprises the steps of: covering a wafer with a non-photosensitive substance layer; covering the non-photosensitive substance layer with a photosensitive substance layer; forming preset patterns on the photosensitive substance layer and the non-photosensitive substance layer through a one-time composition process to expose the surface of the wafer, wherein a first opening is formed in the photosensitive substance layer, a second opening is formed in the non-photosensitive substance layer, and the caliber of the first opening is smaller than that of the second opening; forming a first depth groove in the exposed wafer; forming a second depth groove in the groove bottom of the first depth groove, wherein the width of the second depth groove is smaller than or equal to that of the first depth groove; and removing the remaining non-photosensitive substance layer and photosensitive substance layer on the wafer. The semiconductor device can be formed through a one-time composition process, thereby saving the photoetching step, reducing the step of removing photoresist, and improving the preparation efficiency by reducing the photoetching times.

Description

technical field [0001] The present application relates to the technical field of semiconductor preparation technology, in particular to a method for preparing a semiconductor device. Background technique [0002] Photolithography is a process often used in the preparation of semiconductor devices. It belongs to a main process in the production of planar transistors and integrated circuits. The general photolithography process has to go through silicon wafer surface cleaning and drying, primer coating, spin coating photoresist, soft baking , alignment exposure, post-baking, developing, hard-baking, etching, detection and other processes, the visible lithography process is relatively complicated, and many steps are required to complete a lithography. For the formation of complex patterns in semiconductor devices, sometimes more than two photolithography steps are required to obtain the final pattern. In this way, the photolithography process makes the preparation of semiconduc...

AI Technical Summary

Problems solved by technology

[0002] Photolithography is a process often used in the preparation of semiconductor devices. It belongs to a main process in the production of planar transistors and integrated circuits. The general photolithography process has to go through silicon wafer surface cleaning and drying, primer coating, spin coating photoresist, soft baking , alignment exposure, post-baking, development, hard-baking, etching, detection and other processes, the visible lithography process is more complicated, and it takes many steps to complete a lithography

For the formation of complex patterns in semiconductor devices, sometimes it takes more than two photolithography steps to obtain the final pattern. In this way, the photolithography process makes the preparation of semiconductor devices take a long time and the preparation efficiency is low.

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