A kind of 5g radio frequency front-end assembly equipment and assembly method

Abstract

The invention discloses a 5G radio frequency front-end assembly equipment, comprising a module assembly unit and a circuit forming unit arranged in sequence along the assembly sequence; the module assembly unit includes a substrate forming device and a chip mounting device; the circuit forming unit includes a chip plastic packaging device and a circuit etching device; the chip plastic sealing device comprises a sealing box, a first sealing isolation layer and a sealing cavity, and the sealing cavity is provided with a workpiece rotating device, a plastic sealing molding device and a high voltage generating device; a 5G radio frequency is also disclosed The assembly method of the front-end assembly equipment; the present invention realizes the compounding of the multi-layer substrate and the assembly of the chip with high precision and high efficiency by setting the module assembly unit under the streamlined assembly mode, and is formed by curing organic matter through the chip plastic sealing device. The plastic encapsulation layer that meets the standard is flattened, and the circuit etching device makes the circuit network through the selective etching process, and strictly controls the quality requirements to ensure that the substrate and the chip have good assembly accuracy.

Description

technical field [0001] The invention relates to the field of 5G antenna processing, in particular to a 5G radio frequency front-end assembly equipment and an assembly method thereof. Background technique [0002] With the continuous development of 5G communication technology, the assembly accuracy requirements of the antenna will attract much attention. The RF front-end is the most basic component of the antenna, and its assembly accuracy requirements are particularly important. The existing RF front-end generally adopts the method of assembling device plane distribution and line layered routing. Considering that it is necessary to assemble multi-layer substrates into composite substrates, and install various chips in corresponding positions, it will inevitably lead to equipment assembly accuracy and poor performance. Integration requirements are high. However, in the existing assembly process, due to poor assembly continuity between devices and many artificial doping facto...

AI Technical Summary

Problems solved by technology

The existing RF front-end generally adopts the planar distribution of assembly devices and the layered routing of circuits. Considering the need to assemble multi-layer substrates into composite substrates and install various chips at corresponding positions, it will inevitably lead to equipment assembly accuracy and High integration requirements

However, in the existing assembly process, due to poor assembly continuity between devices and more artificial doping factors, good substrate composite assembly accuracy and chip mounting accuracy cannot be guaranteed in mass production, and The plastic sealing device adopts a one-time plastic sealing molding method, and defects are prone to occur inside the plastic sealing layer. At the same time, the surface of the plastic sealing layer cannot achieve a good flattening effect, thereby affecting the quality and reliability of the workpiece. In addition, the existing chip assembly device uses a single The heat source method uses hot-melt adhesive to install the chip. The heating and melting rate of this method is slow and the effect is poor. It is easy to block the glue outlet due to uneven hot-melt, which is difficult to meet mass production.

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