Environment-friendly solvent-free thick-coating high-adhesion cold spraying zinc sealing agent and construction method thereof
An adhesion type, construction method technology, applied in epoxy resin coatings, coatings, anti-corrosion coatings, etc., can solve the problems of low content of organic additives, peeling of paint skin, reduced adhesion of primers, etc., to promote compactness, The effect of improving the bonding force and strong adhesion
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Embodiment 1
[0069] Described base material comprises at least by mass fraction:
[0070] Epoxy resin: 45 parts;
[0071] Pigment: 40 parts;
[0072] Active diluent: 8 parts;
[0073] Silicon-based polymerizing agent: 10 parts;
[0074] Thixotropic agent: 2 parts;
[0075] Toughener: 2 parts;
[0076] Defoamer: 1.5 parts;
[0077] The curing agent for mixing comprises at least by mass fraction:
[0078] Modified polyamide: 80 parts;
[0079] Silicon-based polymerizing agent: 10 parts;
[0080] Described fast curing agent comprises at least by mass fraction:
[0081] Phenol: 20 parts;
[0082] Paraformaldehyde: 35 parts;
[0083] Diethylenetriamine: 30 parts;
[0084] Thiourea: 25 parts;
[0085] Accelerator: 2 parts.
[0086] Epoxy resin is a mixture of high molecular weight and low molecular weight, the mixing ratio is 1:2, among which high molecular weight epoxy resin is 607 epoxy resin, 604 epoxy resin and 601 epoxy resin mixed with SHB according to 1:2:2 The resulting mix...
Embodiment 2
[0095] Described base material comprises at least by mass fraction:
[0096] Epoxy resin: 55 parts;
[0097] Pigment: 30 parts;
[0098] Reactive diluent: 4 parts;
[0099] Silicon-based polymerizing agent: 5 parts;
[0100] Thixotropic agent: 1 part;
[0101] Toughener: 1 part;
[0102] Defoamer: 0.5 parts;
[0103] The curing agent for mixing comprises at least by mass fraction:
[0104] Modified polyamide: 90 parts;
[0105] Silicon-based polymerizing agent: 5 parts;
[0106] Described fast curing agent comprises at least by mass fraction:
[0107] Phenol: 30 parts;
[0108] Paraformaldehyde: 25 parts;
[0109] Diethylenetriamine: 40 parts;
[0110] Thiourea: 20 parts;
[0111] Accelerator: 1 part.
[0112] The epoxy resin is a mixture of high molecular weight and low molecular weight, and the mixing ratio is 2:1, wherein the high molecular weight epoxy resin is E51 epoxy resin, 828 epoxy resin and 128 epoxy resin mixed according to the ratio of 2:1:1 The resu...
Embodiment 3
[0121] Described base material comprises at least by mass fraction:
[0122] Epoxy resin: 50 parts;
[0123] Pigment: 35 parts;
[0124] Active diluent: 6 parts;
[0125] Silicon-based polymerizing agent: 7 parts;
[0126] Thixotropic agent: 1.5 parts;
[0127] Toughening agent: 1.5 parts;
[0128] Defoamer: 1.2 parts;
[0129] The curing agent for mixing comprises at least by mass fraction:
[0130] Modified polyamide: 85 parts;
[0131] Silicon-based polymerizing agent: 7 parts;
[0132] Described fast curing agent comprises at least by mass fraction:
[0133] Phenol: 25 parts;
[0134] Paraformaldehyde: 30 parts;
[0135] Diethylenetriamine: 35 parts;
[0136] Thiourea: 22 parts;
[0137] Accelerator: 1.5 parts.
[0138] Epoxy resin is a mixture of high molecular weight and low molecular weight, and the mixing ratio is 1:1. Among them, the two epoxy resins of the polymer are 607 epoxy resin, 828 epoxy resin and 128 epoxy resin after mixing according to the rati...
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