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High-adhesion low-modulus epoxy adhesive and preparation method thereof

An epoxy adhesive, low modulus technology, applied in the direction of adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve the problems of low adhesion, colloidal strength reduction, falling off, etc.

Pending Publication Date: 2021-04-13
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is known that this type of adhesive has the advantage of fast curing at low temperature, but if the cured product is exposed to high humidity for a long time, the colloid strength will be greatly reduced and it will easily fall off from the substrate, while the low modulus adhesive Typically the adhesion will be lower after high humidity conditions, so a high-bonding low-modulus adhesive is required

Method used

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  • High-adhesion low-modulus epoxy adhesive and preparation method thereof
  • High-adhesion low-modulus epoxy adhesive and preparation method thereof
  • High-adhesion low-modulus epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The formulation of a high-adhesion low-modulus epoxy adhesive is shown in Table 1.

[0017] Table 1

[0018]

[0019]

[0020] The preparation method of the high-adhesion low-modulus epoxy adhesive in this embodiment is: add EXA-830LVP, MX153, modified epoxy resin, barbituric acid, PEPT and X-12-981S to the double planet Stir in a stirring tank for 20 minutes under vacuum; add white carbon black, mix evenly under vacuum, stir at high speed for 2 hours, then age at room temperature for 16 hours, and finally add PN23J to it, stir under vacuum for 2 hours, mix evenly, and then discharge .

Embodiment 2

[0022] The formulation of a high-adhesion low-modulus epoxy adhesive is shown in Table 2.

[0023] Table 2

[0024] Epon 828 (Hexion Inc, USA) 35 BPA328 (Nippon Shokubai, Japan) 10 Modified epoxy resin 13 salicylic acid 0.5 THIOCURE PE1 (BRUNO BOCK) 30 X-12-981S (Shin-Etsu) 1 Silica 0.5 7501 (Fuijicure) 10

[0025] The preparation method of the high-bonding low-modulus epoxy adhesive in this embodiment is: add Epon 828, BPA328, modified epoxy resin, salicylic acid, THIOCURE PE1 and X-12-981S to the double planetary stirring In the kettle, stir for 20min under vacuum; then add white carbon black to the dual planetary stirring kettle, mix evenly under vacuum, stir at high speed for 2h, then age at room temperature for 14h, finally add 7501 into it, and mix at low speed under vacuum Stir for 1 hour to mix evenly and discharge.

Embodiment 3

[0027] The formulation of a high-adhesion low-modulus epoxy adhesive is shown in Table 3.

[0028] table 3

[0029] EP4901E 30 BPA328 (Nippon Shokubai, Japan) 21 Modified epoxy resin 5 fumaric acid 0.4 THIOCURE TMPMP (BRUNO BOCK) 35 X-12-1154 (Shin-Etsu) 1.5 Silica 0.1 7501 (Fuijicure) 7

[0030] The preparation method of the high-adhesion low-modulus epoxy adhesive in this example is: add EP4901E, BPA328, modified epoxy resin, fumaric acid, TMPMP and X-12-1154 into a double planetary stirring tank by weight , stirred for 20 minutes under vacuum; then added white carbon black to the double planetary stirring tank, mixed evenly under vacuum and stirred at high speed for 2 hours, then aged at room temperature for 14 hours, finally added 7501 to it, and stirred at low speed for 1 hour under vacuum Discharge after mixing evenly.

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Abstract

The invention discloses a high-adhesion low-modulus epoxy adhesive which comprises the following components in parts by weight: 15-55 parts of epoxy resin, 5-35 parts of modified epoxy resin, 0.1-6 parts of a stabilizer, 10-50 parts of a curing agent, 1-10 parts of an accelerant, 0.1-0.5 part of white carbon black and 0.1-10 parts of a coupling agent. The modified epoxy resin added into the high-adhesion low-modulus epoxy adhesive is isocyanate silane coupling agent modified epoxy resin, an amide structure is generated through hydroxyl reaction in the epoxy resin, and an organic chain and a silane structure are introduced, so that the hydrophobicity of the epoxy resin and the adhesion performance of the epoxy resin to the surface of a base material are improved, especially for glass and metal interfaces, and meanwhile, the epoxy value of the epoxy resin itself is not affected, and the curing reaction of the epoxy resin itself is not affected.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a high-bonding low-modulus epoxy adhesive and a preparation method thereof. Background technique [0002] Epoxy resin is a kind of thermosetting polymer with good adhesion, corrosion resistance, electrical insulation, high strength and other properties. Its excellent performance is also widely used in the electronics industry. Many electronic components are in various complex environments, so low modulus requirements are put forward for adhesives. Most of this type of adhesives use mercaptan epoxy systems. [0003] It is known that this type of adhesive has the advantage of fast curing at low temperature, but if the cured product is exposed to high humidity for a long time, the colloid strength will be greatly reduced and it will easily fall off from the substrate, while the low modulus adhesive Typically the adhesion will be lower after high humidity conditions, thus requiring a high ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/08C09J11/06C08G59/14
CPCC09J163/00C09J11/04C09J11/08C09J11/06C08G59/1477C08L2205/03C08L2205/025C08L2201/08C08L63/00C08L83/04C08K7/26C08K5/54
Inventor 刘磊陈田安王建斌
Owner YANTAI DARBOND TECH
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