Lead frame cleaning mechanism

Abstract

The invention discloses a lead frame cleaning mechanism, and particularly relates to the technical field of semiconductors. The lead frame cleaning mechanism comprises a box, an adapter tube and a hinge. A water pipe mounting hole is formed in the top surface of the box, a box door is movably mounted on the side surface of the box through the hinge, a sealing ring is fixedly mounted on the side surface of the box door, an observation window is formed in the side surface of the box door, a partition plate is fixedly mounted in an inner cavity of the box, a fixed bottom rod is fixedly mounted on the top face of the partition plate, a locking device is fixedly mounted on the side face of the fixed bottom rod, and a fixed top rod is fixedly mounted on the top of the fixed bottom rod through the hinge. By arranging the bottom of the box to be gradually lowered from left to right, when cleaning liquid on the upper part is scattered at the bottom of the inner cavity of the box, the cleaning liquid can be completely discharged by arranging the bottom of the box, the situation that the equipment cannot work normally due to accumulation of the cleaning liquid is avoided, and the practicability of the equipment is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor technology, more specifically, the invention is a lead frame cleaning mechanism. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] During the processing of lead frame seal, copper oxide and other pollutants will cause delamination of molding compound and copper lead frame, which will reduce the reliability of the device and affect the quality of chip bonding and wire bonding. The lead frame needs to be cleaned during the production process of the ...

AI Technical Summary

Problems solved by technology

[0003] During the processing of lead frame seal, copper oxide and other pollutants will cause delamination of molding compound and copper lead frame, which will reduce the reliability of the device and affect the quality of chip bonding and wire bonding. The lead frame needs to be cleaned during the production process of the lead frame. At present, most of the cleaning of the lead frame is done with a nozzle, and the high-pressure water flow from the nozzle is used to remove the dirt on the surface of the lead frame. However, during use, it is found that , the existing lead frame machine cleaning mechanism can only clean the upper and lower sides of the lead frame, so some parts of the lead frame will not be cleaned, resulting in incomplete cleaning of the lead frame, thus affecting the performance of the lead frame

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