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CeO2-doped Cu/Mn composite film/microcrystalline interface layer and metal matrix composite connector and preparation method thereof

A metal-based composite and interface layer technology, which is applied in coatings, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as poor commercialization prospects and poor electrical conductivity, and achieve shortened reaction stability time and high electrical conductivity. , The effect of fine and uniform grain size

Active Publication Date: 2021-04-06
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cr-containing spinel film MgCr 2 o 4 , Mn 1.2 Cr 1.8 o 4 、NiCr 2 o 4 、CuCr 2 o 4 、ZnCr 2 o 4 、CoCr 2 o 4 and other poor electrical conductivity (except CoCr 2 o 4 Outside the film layer, other conductivity is 0.01~0.4S·cm -1 around), the thermal expansion coefficient is 7×10 -6 K -1 (The TEC of the stainless steel plate is at 11×10 -6 K -1 around), and there are serious problems such as Cr volatilization, and the commercialization prospect is not good. Therefore, the Cr-free film material is the research focus

Method used

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  • CeO2-doped Cu/Mn composite film/microcrystalline interface layer and metal matrix composite connector and preparation method thereof
  • CeO2-doped Cu/Mn composite film/microcrystalline interface layer and metal matrix composite connector and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Step (1) The 430SS base material is polished with 400#~2000# water-grinding paper, then cleaned with distilled water and acetone, air-dried or blow-dried, and sealed for storage.

[0022] Step (2) Deposit a layer of flat 430SS fine grain transition layer on the surface of the substrate by high-temperature micro-arc alloying technology with an electrode rod with a diameter of 2mm, adjust the voltage to 180V, and prepare 430SS fine grain transition layer on the surface of the substrate. Grain layer, and then the prepared refined grain layer is repaired and flattened.

[0023] Step (3) First configure 400ml of electrolyte solution in a beaker for impact Ni plating, first pour 200ml of distilled water into the beaker, and then add 1M NiCl 2 , stirred until no precipitate was added, and then 128 mL of HCl was added and distilled water was gradually added to 400 mL. Configure 400ml electrolyte solution to electrodeposit Cu, first pour 300ml distilled water into the beaker, t...

Embodiment 2

[0027] Step (1) The 430SS base material is polished with 400#~2000# water-grinding paper, then cleaned with distilled water and acetone, air-dried or blow-dried, and sealed for storage.

[0028] Step (2) Deposit a layer of smooth 430SS fine grain transition layer on the surface of the substrate by high-temperature micro-arc alloying technology with an electrode rod with a diameter of 2mm, adjust the voltage to 190V, and prepare 430SS fine grain transition layer on the surface of the substrate. Grain layer, and the prepared refined grain layer is repaired and flattened.

[0029] Step (3) First configure 400ml of electrolyte solution in a beaker for impact Ni plating, first pour 200ml of distilled water into the beaker, and then add 1M NiCl 2 , stirred until no precipitate was added, and then 128 mL of HCl was added and distilled water was gradually added to 400 mL. Prepare 400ml of electrolytic deposition Cu electrolyte solution, first pour 300ml of distilled water into the be...

Embodiment 3

[0033] Step (1) The 430SS base material is polished with 400#~2000# water-grinding paper, then cleaned with distilled water and acetone, air-dried or blow-dried, and sealed for storage.

[0034] Step (2) Deposit a layer of flat 430SS fine grain transition layer on the surface of the substrate by high-temperature micro-arc alloying technology with an electrode rod with a diameter of 2.5mm, adjust the voltage to 200V, and prepare 430SS fine grain transition layer on the surface of the substrate. refine the grain layer, and repair and smooth the prepared grain refinement layer.

[0035] Step (3) First configure 400ml of electrolyte solution in a beaker for impact Ni plating, first pour 200ml of distilled water into the beaker, and then add 1M NiCl 2 , stirred until no precipitate was added, and then 128 mL of HCl was added and distilled water was gradually added to 400 mL. Prepare 400ml of electrolyte solution for electrodeposition Cu, first pour 300ml of distilled water into th...

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Abstract

The invention discloses a CeO2-doped Cu / Mn composite film / microcrystalline interface layer and metal matrix composite connector and a preparation method thereof, and relates to the field of solid oxide fuel cell metal connector composite materials. Firstly, a microcrystalline transition layer of a matrix material is deposed through a high-energy micro-arc alloy technology; then, a composite film plated with metal Cu and combined with nanoscale CeO2 particles is compounded through an electrochemical deposition method; and then metal Mn is electrochemically deposited to serve as an outer layer of the whole composite material, wherein a certain amount of nanoscale CeO2 is added during electrodeposition of a Cu plating layer to refine grains of the plating layer, so that the high-temperature diffusivity of elements and the high-temperature oxidation resistance of a composite layer are improved. The CeO2-doped Cu / Mn composite film / microcrystalline interface layer and metal matrix composite connector and the preparation method thereof have the beneficial effects that the prepared microcrystalline interface layer and metal matrix composite connector is high in conductivity and excellent in high-temperature oxidation resistance, and can effectively prevent the Cr element in the metal base material from diffusing outwards, so that the service life of the solid oxide fuel cell metal connector is prolonged, and the working efficiency of the solid oxide fuel cell metal connector is improved.

Description

technical field [0001] The present invention relates to a solid oxide fuel cell metal connector composite material, in particular to a method for preparing a CeO2-doped Cu / Mn composite film / microcrystalline interface layer and a metal-based composite connector, which is applied to a solid oxide fuel batteries or other high temperature batteries. Background technique [0002] Solid Oxide Fuel Cell (SOFC) has the advantages of wide fuel adaptability, high energy conversion efficiency, all solid state, modular assembly, zero pollution, etc., and can directly use hydrogen, carbon monoxide, natural gas, liquefied petroleum gas, and coal gas and biomass gas and other hydrocarbon fuels. Solid oxide fuel cells have a wide range of applications, covering almost all traditional power markets, including residential, commercial, industrial, and public utility power plants, and even portable power sources, mobile power sources, and remote areas. High-quality power supply, etc., can als...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D15/00C25D5/36C25D5/50H01M8/0297
CPCC25D3/12C25D15/00C25D5/36C25D5/505H01M8/0297Y02E60/50Y02P70/50
Inventor 郭平义丁江涛邵勇黄铭瑞毛胜勇王宇鑫何震郭云霞王冬朋欧文祥
Owner JIANGSU UNIV OF SCI & TECH
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